- Manufacture :
-
- Texas Instruments (1)
- 3M (41)
- Amphenol FCI (106)
- Apex Microtechnology (2)
- Aries Electronics (1131)
- Assmann WSW Components (1)
- Grayhill Inc. (4)
- Harwin Inc. (8)
- Mill-Max Manufacturing Corp. (189)
- Omron Electronics Inc-EMC Div (11)
- Preci-Dip (154)
- Samtec Inc. (12)
- TE Connectivity AMP Connectors (300)
- TE Connectivity Potter & Brumfield Relays (1)
- Series :
-
- 117 (1)
- 210 (47)
- 214 (18)
- 217 (1)
- 22 (4)
- 299 (135)
- 410 (3)
- 415 (1)
- 500 (99)
- 510 (41)
- 514 (4)
- 516 (10)
- 518 (4)
- 547 (2)
- 55 (190)
- 550 (23)
- 558 (23)
- 57 (262)
- 8058 (21)
- 8059 (1)
- 8060 (25)
- 8080 (19)
- 917 (20)
- 940 (29)
- Apex Precision Power® (2)
- D2 (1)
- D39 (7)
- Diplomate DL (60)
- EJECT-A-DIP™ (65)
- Lo-PRO®file, 513 (244)
- Lo-PRO®file, 526 (6)
- OEM (8)
- PLS (85)
- PRL (2)
- PRS (130)
- SIP050-1x (61)
- SIP1x (44)
- Textool™ (31)
- Vertisockets™ 800 (134)
- XR2 (11)
- Part Status :
- Packaging :
- Type :
-
- BGA (25)
- CLCC (4)
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (30)
- DIP, 0.3" (7.62mm) Row Spacing (354)
- DIP, 0.4" (10.16mm) Row Spacing (31)
- DIP, 0.6" (15.24mm) Row Spacing (327)
- DIP, 0.75" (19.05mm) Row Spacing (2)
- DIP, 0.9" (22.86mm) Row Spacing (45)
- DIP, ZIF (ZIP) (17)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (216)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (240)
- Housing (1)
- LGA (2)
- PGA (64)
- PGA, ZIF (ZIP) (220)
- PLCC (53)
- QFN (6)
- SIP (190)
- SOIC (9)
- SOIC, ZIF (ZIP) (2)
- Transistor (3)
- Transistor, TO-100 (6)
- Transistor, TO-3 (50)
- Transistor, TO-3 and TO-66 (1)
- Transistor, TO-5 (56)
- Zig-Zag (3)
- Zig-Zag, Left Stackable (2)
- Zig-Zag, Right Stackable (1)
- Zig-Zag, ZIF (ZIP) (12)
- Housing Material :
-
- Diallyl Phthalate (DAP) (13)
- Fluoropolymer (FP) (8)
- FR4 Epoxy Glass (50)
- Liquid Crystal Polymer (LCP) (12)
- Phenolic (7)
- Polyamide (PA), Nylon (3)
- Polyamide (PA), Nylon, Glass Filled (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (459)
- Polybutylene Terephthalate (PBT), Glass Filled (11)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (240)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (165)
- Polyester (15)
- Polyester, Glass Filled (3)
- Polyether Imide (PEI), Glass Filled (4)
- Polyethersulfone (PES) (6)
- Polyethersulfone (PES), Glass Filled (9)
- Polyphenylene Sulfide (PPS) (219)
- Polyphenylene Sulfide (PPS), Glass Filled (503)
- Polysulfone (PSU), Glass Filled (17)
- Polytetrafluoroethylene (PTFE) (57)
- Thermoplastic (16)
- Thermoplastic, Glass Filled (58)
- Thermoplastic, Polyester (41)
- Thermoplastic, Polyester, Glass Filled (2)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (17)
- 10 (2 x 5) (53)
- 10 (Round) (8)
- 100 (10 x 10) (2)
- 11 (1 x 11) (6)
- 12 (1 x 12) (7)
- 12 (2 x 6) (31)
- 1207 (33 x 34) (2)
- 121 (11 x 11) (2)
- 13 (1 x 13) (5)
- 14 (1 x 14) (7)
- 14 (2 x 7) (68)
- 144 (12 x 12) (4)
- 145 (15 x 15) (1)
- 15 (1 x 15) (8)
- 16 (1 x 16) (12)
- 16 (2 x 8) (74)
- 169 (13 x 13) (2)
- 17 (1 x 17) (4)
- 18 (1 x 18) (4)
- 18 (2 x 9) (38)
- 19 (1 x 19) (2)
- 192 (16 x 16) (2)
- 196 (14 x 14) (2)
- 2 (1 x 2) (10)
- 20 (1 x 20) (21)
- 20 (2 x 10) (55)
- 20 (4 x 5) (4)
- 20 (Round) (1)
- 21 (1 x 21) (4)
- 22 (1 x 22) (3)
- 22 (2 x 11) (24)
- 225 (15 x 15) (2)
- 23 (1 x 23) (3)
- 24 (1 x 24) (2)
- 24 (2 x 12) (134)
- 25 (1 x 25) (3)
- 25 (5 x 5) (2)
- 255 (16 x 16) (2)
- 256 (16 x 16) (6)
- 256 (20 x 20) (2)
- 26 (1 x 26) (2)
- 26 (2 x 13) (16)
- 261 (19 x 19) (1)
- 27 (1 x 27) (4)
- 272 (20 x 20) (2)
- 28 (1 x 28) (3)
- 28 (2 x 14) (117)
- 28 (4 x 7) (6)
- 289 (17 x 17) (2)
- 29 (1 x 29) (2)
- 292 (20 x 20) (2)
- 3 (1 x 3) (4)
- 3 (Oval) (44)
- 3 (Rectangular) (1)
- 3 (Round) (18)
- 30 (1 x 30) (5)
- 30 (2 x 15) (25)
- 31 (1 x 31) (2)
- 32 (1 x 32) (12)
- 32 (2 x 16) (105)
- 32 (2 x 7, 2 x 9) (6)
- 32 (4 x 8) (1)
- 324 (18 x 18) (2)
- 34 (1 x 34) (1)
- 34 (2 x 17) (11)
- 35 (1 x 17, 1 x 18) (4)
- 352 (26 x 26) (2)
- 356 (26 x 26) (2)
- 357 (19 x 19) (2)
- 36 (2 x 18) (77)
- 36 (6 x 6) (2)
- 360 (19 x 19) (2)
- 361 (19 x 19) (2)
- 38 (2 x 19) (8)
- 388 (26 x 26) (2)
- 39 (1 x 19, 1 x 20) (2)
- 4 (1 x 4) (6)
- 4 (2 x 2) (7)
- 4 (Round) (19)
- 40 (2 x 20) (121)
- 40 (4 x 10) (2)
- 400 (20 x 20) (6)
- 42 (2 x 21) (59)
- 420 (26 x 26) (2)
- 432 (31 x 31) (2)
- 44 (2 x 22) (60)
- 44 (4 x 11) (7)
- 441 (21 x 21) (2)
- 456 (26 x 26) (2)
- 48 (2 x 24) (66)
- 48 (4 x 12) (3)
- 480 (29 x 29) (2)
- 49 (7 x 7) (2)
- 5 (1 x 5) (7)
- 50 (2 x 25) (5)
- 500 (30 x 30) (2)
- 504 (29 x 29) (2)
- 51 (1 x 25, 1 x 26) (4)
- 52 (2 x 26) (1)
- 52 (4 x 13) (6)
- 520 (31 x 31) (2)
- 560 (33 x 33) (2)
- 576 (30 x 30) (2)
- 6 (1 x 6) (5)
- 6 (2 x 3) (41)
- 60 (2 x 30) (5)
- 600 (35 x 35) (2)
- 64 (1 x 64) (3)
- 64 (2 x 32) (10)
- 64 (8 x 8) (2)
- 652 (35 x 35) (2)
- 68 (4 x 17) (9)
- 7 (1 x 7) (5)
- 72 (2 x 36) (1)
- 8 (1 x 8) (10)
- 8 (2 x 4) (68)
- 8 (Oval) (2)
- 8 (Round) (23)
- 81 (9 x 9) (2)
- 84 (4 x 21) (7)
- 9 (1 x 9) (4)
- 90 (2 x 45) (1)
- 99 (1 x 99) (1)
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1961 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,472
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 4POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Tin | 4 (Round) | Beryllium Copper | - | - | Brass | |||
|
|
VIEW |
1,977
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Nickel | 3 (Oval) | Beryllium Copper | - | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,925
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 50.0µin (1.27µm) | - | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
1,999
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Nickel | 3 (Oval) | Beryllium Copper | - | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,766
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Gold | 30.0µin (0.76µm) | Nickel | 3 (Oval) | Beryllium Copper | - | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,830
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Silver | 500.0µin (12.70µm) | - | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
1,681
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Copper | 3 (Oval) | Beryllium Copper | - | 100.0µin (2.54µm) | Beryllium Copper | |||
|
|
VIEW |
2,017
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Gold | - | Gold | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
3,724
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
3,043
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Obsolete | - | - | Through Hole | Solder | Closed Frame | SIP | Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (1 x 10) | Beryllium Copper | 0.100" (2.54mm) | Flash | Beryllium Copper | |||
|
|
VIEW |
3,881
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | 500.0µin (12.70µm) | Beryllium Copper | |||
|
|
VIEW |
2,188
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | 500.0µin (12.70µm) | Beryllium Copper | |||
|
|
VIEW |
1,020
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | - | 20.0µin (0.51µm) | Beryllium Copper | |||
|
|
VIEW |
3,037
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
3,389
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 500.0µin (12.70µm) | Silver | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
1,036
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Silver | 50.0µin (1.27µm) | Silver | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
1,530
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Gold | 30.0µin (0.76µm) | Gold | 3 (Oval) | Beryllium Copper | - | - | Beryllium Copper | |||
|
|
VIEW |
1,882
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Gold | 3 (Round) | Beryllium Copper | - | - | Brass | |||
|
|
VIEW |
2,750
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 10POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Tin-Lead | 10 (Round) | Beryllium Copper | - | - | Brass | |||
|
|
VIEW |
645
In-stock
|
Amphenol FCI | CONN SOCKET SIP 2POS TIN | - | Obsolete | Tape & Reel (TR) | - | Surface Mount | Solder | Closed Frame | SIP | Polyamide (PA), Nylon | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 2 (1 x 2) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
728
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,185
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,890
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,934
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,317
In-stock
|
Grayhill Inc. | CONN SOCKET TRANSIST 3POS GOLD | 22 | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | Transistor | Thermoplastic, Glass Filled | - | Gold | - | Gold | 3 (Round) | Beryllium Copper | - | - | Beryllium Copper | |||
