Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,977
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper - 50.0µin (1.27µm) Beryllium Copper
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1,999
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TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper - 50.0µin (1.27µm) Beryllium Copper
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1,766
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Phenolic - Gold 30.0µin (0.76µm) Nickel 3 (Oval) Beryllium Copper - 50.0µin (1.27µm) Beryllium Copper
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1,530
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Gold 30.0µin (0.76µm) Gold 3 (Oval) Beryllium Copper - - Beryllium Copper
268-5401-52-1102JH
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3,406
In-stock
3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
268-5401-50-1102JH
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2,908
In-stock
3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
268-5401-11-1102JH
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RFQ
1,245
In-stock
3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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2,133
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
1,454
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
1,350
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
3,062
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
2,801
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
1,998
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
2,914
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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2,196
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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925
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
3,086
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
3,023
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
3,693
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,994
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,068
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
2,176
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,719
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
3,883
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,941
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,951
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
2,568
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,992
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,057
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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RFQ
1,339
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper