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7 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,477
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 4POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Gold | 4 (2 x 2) | Beryllium Copper | - | Beryllium Copper | |||
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VIEW |
3,370
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 4POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | - | 4 (2 x 2) | Beryllium Copper | - | Brass | |||
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VIEW |
3,929
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 4 (2 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
676
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,364
In-stock
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Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,368
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 4 (2 x 2) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,906
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 4POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 4 (2 x 2) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
