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60 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post
GLOBAL STOCKS
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44-6575-18
RFQ
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RFQ
1,002
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6574-18
RFQ
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RFQ
2,595
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3575-18
RFQ
VIEW
RFQ
2,010
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3574-18
RFQ
VIEW
RFQ
1,398
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6554-16
RFQ
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RFQ
1,656
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3552-16
RFQ
VIEW
RFQ
1,069
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3551-16
RFQ
VIEW
RFQ
2,707
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6553-16
RFQ
VIEW
RFQ
3,863
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6554-11
RFQ
VIEW
RFQ
1,748
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6553-11
RFQ
VIEW
RFQ
656
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3554-11
RFQ
VIEW
RFQ
2,820
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6552-11
RFQ
VIEW
RFQ
3,945
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6551-11
RFQ
VIEW
RFQ
3,179
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3553-11
RFQ
VIEW
RFQ
2,688
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3552-11
RFQ
VIEW
RFQ
3,835
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3551-11
RFQ
VIEW
RFQ
2,975
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6571-10
RFQ
VIEW
RFQ
3,960
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6575-10
RFQ
VIEW
RFQ
3,228
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6574-10
RFQ
VIEW
RFQ
853
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6573-10
RFQ
VIEW
RFQ
3,667
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6572-10
RFQ
VIEW
RFQ
784
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6570-10
RFQ
VIEW
RFQ
799
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3575-10
RFQ
VIEW
RFQ
1,172
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3574-10
RFQ
VIEW
RFQ
2,335
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3573-10
RFQ
VIEW
RFQ
1,221
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3572-10
RFQ
VIEW
RFQ
1,325
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3571-10
RFQ
VIEW
RFQ
1,893
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-3570-10
RFQ
VIEW
RFQ
3,203
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6571-11
RFQ
VIEW
RFQ
951
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
Default Photo
44-6575-11
RFQ
VIEW
RFQ
607
In-stock
 Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm)
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