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13 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
1,267
In-stock
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3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
2,639
In-stock
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3M | CONN ZIG-ZAG 39POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Zig-Zag | Polysulfone (PSU), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 39 (1 x 19, 1 x 20) | Beryllium Copper | 0.100" (2.54mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,287
In-stock
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3M | CONN SOCKET SOIC 18POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 18 (2 x 9) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,809
In-stock
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 16 (2 x 8) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,560
In-stock
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
2,685
In-stock
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3M | CONN SOCKET SOIC 16POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 16 (2 x 8) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
783
In-stock
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3M | CONN SOCKET SOIC 14POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 14 (2 x 7) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
1,305
In-stock
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3M | CONN SOCKET SOIC 24POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 24 (2 x 12) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
2,716
In-stock
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3M | CONN SOCKET SOIC 20POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 20 (2 x 10) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,100
In-stock
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3M | CONN SOCKET SOIC 28POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | - | Gold | 28 (2 x 14) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
657
In-stock
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Texas Instruments | CONN TRANSIST TO-3 8POS GOLD | - | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Polyester, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 8 (Oval) | Beryllium Copper | - | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,992
In-stock
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3M | CONN TRANSIST TO-3/TO-66 3POS | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 and TO-66 | Polyphenylene Sulfide (PPS), Glass Filled | - | Gold | 30.0µin (0.76µm) | Gold | 3 (Rectangular) | Beryllium Copper | 0.234" (5.94mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
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VIEW |
3,864
In-stock
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3M | CONN SOCKET SOIC 8POS GOLD | Textool™ | Active | Bulk | -55°C ~ 150°C | Through Hole | Solder | Closed Frame | SOIC | Polyethersulfone (PES), Glass Filled | - | Gold | 30.0µin (0.76µm) | Gold | 8 (2 x 4) | Beryllium Copper | - | 30.0µin (0.76µm) | Beryllium Copper | |||
