- Part Status :
- Packaging :
- Mounting Type :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 192 (16 x 16) (2)
- 20 (4 x 5) (2)
- 255 (16 x 16) (2)
- 256 (16 x 16) (4)
- 256 (20 x 20) (2)
- 272 (20 x 20) (2)
- 28 (4 x 7) (4)
- 292 (20 x 20) (2)
- 32 (2 x 7, 2 x 9) (4)
- 34 (1 x 34) (1)
- 34 (2 x 17) (3)
- 35 (1 x 17, 1 x 18) (4)
- 352 (26 x 26) (2)
- 356 (26 x 26) (2)
- 357 (19 x 19) (2)
- 360 (19 x 19) (2)
- 388 (26 x 26) (2)
- 400 (20 x 20) (4)
- 420 (26 x 26) (2)
- 432 (31 x 31) (2)
- 44 (4 x 11) (5)
- 456 (26 x 26) (2)
- 480 (29 x 29) (2)
- 500 (30 x 30) (2)
- 504 (29 x 29) (2)
- 51 (1 x 25, 1 x 26) (4)
- 52 (4 x 13) (4)
- 520 (31 x 31) (2)
- 560 (33 x 33) (2)
- 576 (30 x 30) (2)
- 600 (35 x 35) (2)
- 652 (35 x 35) (2)
- 68 (4 x 17) (3)
- 84 (4 x 21) (5)
- Contact Material - Post :
- Applied Filters :
89 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,767
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 32POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin-Lead | 100.0µin (2.54µm) | 32 (2 x 7, 2 x 9) | Beryllium Copper | 0.050" (1.27mm) | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,775
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 28POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin-Lead | 100.0µin (2.54µm) | 28 (4 x 7) | Beryllium Copper | 0.050" (1.27mm) | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
1,975
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET PLCC 20POS TIN-LEAD | 940 | Obsolete | Tube | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PLCC | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.050" (1.27mm) | Tin-Lead | 100.0µin (2.54µm) | 20 (4 x 5) | Beryllium Copper | 0.050" (1.27mm) | 200.0µin (5.08µm) | Brass Alloy | |||
|
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 652 (35 x 35) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 600 (35 x 35) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 576 (30 x 30) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 520 (31 x 31) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 560 (33 x 33) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 504 (29 x 29) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 500 (30 x 30) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 480 (29 x 29) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 456 (26 x 26) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
955
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | 0.050" (1.27mm) | Flash | Brass | |||
|
|
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 432 (31 x 31) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 652 (35 x 35) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,593
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | 400 (20 x 20) | Beryllium Copper | 0.050" (1.27mm) | Flash | Brass | |||
|
|
VIEW |
3,763
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 420 (26 x 26) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,371
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 400 (20 x 20) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 600 (35 x 35) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
849
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 388 (26 x 26) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 576 (30 x 30) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
975
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 560 (33 x 33) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,172
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 272 (20 x 20) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,682
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 256 (16 x 16) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,409
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 256 (20 x 20) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,721
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 192 (16 x 16) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,079
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
1,594
In-stock
|
3M | CONN ZIG-ZAG ZIF 51POS GOLD | Textool™ | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Zig-Zag, ZIF (ZIP) | Polysulfone (PSU), Glass Filled | 0.050" (1.27mm) | Gold | 30.0µin (0.76µm) | 51 (1 x 25, 1 x 26) | Beryllium Copper | 0.050" (1.27mm) | 30.0µin (0.76µm) | Beryllium Copper | |||
|
|
VIEW |
3,064
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 360 (19 x 19) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,408
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | 357 (19 x 19) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
