- Part Status :
- Operating Temperature :
- Type :
- Housing Material :
-
- Polybutylene Terephthalate (PBT), Glass Filled (4)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Polyester, Glass Filled (1)
- Polyphenylene Sulfide (PPS) (1)
- Polyphenylene Sulfide (PPS), Glass Filled (3)
- Thermoplastic (1)
- Thermoplastic, Glass Filled (3)
- Thermoplastic, Polyester (4)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
21 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
3,966
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,583
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
673
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,304
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,459
In-stock
|
Amphenol FCI | CONN SOCKET SIP 20POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
2,629
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (1 x 20) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
2,760
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (1 x 20) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
3,261
In-stock
|
Omron Electronics Inc-EMC Div | CONN IC SOCKET 20POS | XR2 | Obsolete | Bulk | -55°C ~ 125°C | - | Solder | Closed Frame | Housing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | - | - | - | 20 (1 x 20) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
1,980
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Gold | 20 (1 x 20) | Beryllium Copper | 29.5µin (0.75µm) | Brass | ||||
VIEW |
1,588
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
1,471
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
1,176
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,026
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
1,586
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,483
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 500 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
3,850
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 20POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 20 (1 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | ||||
VIEW |
3,988
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | 510 | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Tin | 20 (1 x 20) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
1,591
In-stock
|
Assmann WSW Components | SOCKET 20 CONTACTS SINGLE ROW | - | Active | - | -40°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | ||||
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 20 (1 x 20) | Beryllium Copper | 196.9µin (5.00µm) | Brass | ||||
VIEW |
2,495
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS TINLEAD | - | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 20 (1 x 20) | Beryllium Copper | - | Brass | ||||
VIEW |
1,262
In-stock
|
Apex Microtechnology | CONN SOCKET SIP 20POS GOLD | Apex Precision Power® | Active | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (1 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass |