Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,777
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Amphenol FCI CONN SOCKET SIP 15POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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833
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Amphenol FCI CONN SOCKET SIP 15POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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1,231
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Amphenol FCI CONN SOCKET SIP 15POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
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1,592
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Amphenol FCI CONN SOCKET SIP 15POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) 15 (1 x 15) Beryllium Copper 200.0µin (5.08µm) Brass
643647-1
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3,910
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TE Connectivity AMP Connectors CONN SOCKET SIP 15POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 15 (1 x 15) Beryllium Copper - Beryllium Copper
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3,584
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Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,652
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TE Connectivity AMP Connectors CONN SOCKET SIP 15POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - 15 (1 x 15) Beryllium Copper - Beryllium Copper
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975
In-stock
Omron Electronics Inc-EMC Div CONN SOCKET SIP 15POS GOLD XR2 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 15 (1 x 15) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper