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8 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
3,777
In-stock
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Amphenol FCI | CONN SOCKET SIP 15POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 15 (1 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
833
In-stock
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Amphenol FCI | CONN SOCKET SIP 15POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 15 (1 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,231
In-stock
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Amphenol FCI | CONN SOCKET SIP 15POS GOLD | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 15 (1 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,592
In-stock
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Amphenol FCI | CONN SOCKET SIP 15POS TIN | SIP1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 150.0µin (3.81µm) | 15 (1 x 15) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,910
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 15POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 15 (1 x 15) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,584
In-stock
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Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,652
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 15POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 15 (1 x 15) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
975
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 15POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 15 (1 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Beryllium Copper |