Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,828
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,252
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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3,043
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Obsolete - - Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold Flash Tin 10 (1 x 10) Beryllium Copper Flash Beryllium Copper
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645
In-stock
Amphenol FCI CONN SOCKET SIP 2POS TIN - Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame SIP Polyamide (PA), Nylon 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,547
In-stock
Harwin Inc. CONN IC DIP SOCKET 24POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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3,573
In-stock
Harwin Inc. CONN IC DIP SOCKET 20POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 20 (2 x 10) Beryllium Copper 196.9µin (5.00µm) Brass
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728
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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3,185
In-stock
Harwin Inc. CONN IC DIP SOCKET 16POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 196.9µin (5.00µm) Brass
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1,890
In-stock
Harwin Inc. CONN IC DIP SOCKET 14POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 196.9µin (5.00µm) Brass
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1,060
In-stock
Harwin Inc. CONN IC DIP SOCKET 8POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
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3,934
In-stock
Harwin Inc. CONN IC DIP SOCKET 6POS GOLD D39 Obsolete Bulk -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 6 (2 x 3) Beryllium Copper 196.9µin (5.00µm) Brass
940-99-084-24-000000
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2,714
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 84POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 84 (4 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-068-24-000000
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2,874
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 68POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 68 (4 x 17) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-052-24-000000
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3,104
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 52POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 52 (4 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,946
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Mill-Max Manufacturing Corp. CONN SOCKET PLCC 44POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 44 (4 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-032-24-000000
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1,261
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 32POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 32 (2 x 7, 2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-028-24-000000
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3,986
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 28POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 28 (4 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-020-24-000000
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3,757
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 20POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 20 (4 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
268-5401-52-1102JH
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3,406
In-stock
3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
268-5401-50-1102JH
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2,908
In-stock
3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
268-5401-11-1102JH
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1,245
In-stock
3M CONN SOCKET CLCC 68POS GOLD OEM Discontinued at Digi-Key Tray -55°C ~ 105°C Through Hole Solder Closed Frame CLCC Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 68 (4 x 17) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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2,161
In-stock
3M CONN IC DIP SOCKET ZIF 40POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 40 (2 x 20) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
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806
In-stock
3M CONN IC DIP SOCKET ZIF 20POS GLD OEM Obsolete Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyether Imide (PEI), Glass Filled 0.100" (2.54mm) Gold 250.0µin (6.35µm) Gold 20 (2 x 10) Beryllium Copper 250.0µin (6.35µm) Beryllium Copper
28-516-10
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2,644
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
2-640361-4
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3,285
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 24 (2 x 12) Beryllium Copper 15.0µin (0.38µm) Beryllium Copper
24-516-10
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1,927
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
40-516-10
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3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS TIN 516 Obsolete Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP) Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
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2,133
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,454
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,350
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper