- Part Status :
- Packaging :
- Operating Temperature :
- Housing Material :
-
- Fluoropolymer (FP) (1)
- FR4 Epoxy Glass (50)
- Polyamide (PA), Nylon (2)
- Polyamide (PA), Nylon, Glass Filled (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (443)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (7)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (165)
- Polyester (1)
- Polyester, Glass Filled (3)
- Polyphenylene Sulfide (PPS) (1)
- Polyphenylene Sulfide (PPS), Glass Filled (44)
- Polytetrafluoroethylene (PTFE) (20)
- Thermoplastic (8)
- Thermoplastic, Polyester (28)
- Thermoplastic, Polyester, Glass Filled (2)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (11)
- 10 (2 x 5) (45)
- 10 (Round) (4)
- 100 (10 x 10) (2)
- 11 (1 x 11) (3)
- 12 (1 x 12) (4)
- 12 (2 x 6) (25)
- 121 (11 x 11) (2)
- 13 (1 x 13) (3)
- 14 (1 x 14) (4)
- 14 (2 x 7) (42)
- 144 (12 x 12) (4)
- 15 (1 x 15) (4)
- 16 (1 x 16) (8)
- 16 (2 x 8) (43)
- 169 (13 x 13) (2)
- 17 (1 x 17) (3)
- 18 (1 x 18) (2)
- 18 (2 x 9) (24)
- 19 (1 x 19) (2)
- 192 (16 x 16) (2)
- 196 (14 x 14) (2)
- 2 (1 x 2) (8)
- 20 (1 x 20) (10)
- 20 (2 x 10) (32)
- 20 (Round) (1)
- 21 (1 x 21) (3)
- 22 (1 x 22) (2)
- 22 (2 x 11) (18)
- 225 (15 x 15) (2)
- 23 (1 x 23) (2)
- 24 (1 x 24) (2)
- 24 (2 x 12) (40)
- 25 (1 x 25) (2)
- 25 (5 x 5) (2)
- 255 (16 x 16) (2)
- 256 (16 x 16) (6)
- 256 (20 x 20) (2)
- 26 (1 x 26) (2)
- 26 (2 x 13) (14)
- 27 (1 x 27) (4)
- 272 (20 x 20) (2)
- 28 (1 x 28) (3)
- 28 (2 x 14) (31)
- 289 (17 x 17) (2)
- 29 (1 x 29) (2)
- 292 (20 x 20) (2)
- 3 (1 x 3) (3)
- 3 (Round) (4)
- 30 (1 x 30) (4)
- 30 (2 x 15) (23)
- 31 (1 x 31) (2)
- 32 (1 x 32) (10)
- 32 (2 x 16) (37)
- 324 (18 x 18) (2)
- 34 (2 x 17) (8)
- 352 (26 x 26) (2)
- 356 (26 x 26) (2)
- 357 (19 x 19) (2)
- 36 (2 x 18) (17)
- 36 (6 x 6) (2)
- 360 (19 x 19) (2)
- 361 (19 x 19) (2)
- 38 (2 x 19) (8)
- 388 (26 x 26) (2)
- 4 (1 x 4) (6)
- 4 (2 x 2) (6)
- 4 (Round) (4)
- 40 (2 x 20) (38)
- 400 (20 x 20) (6)
- 42 (2 x 21) (1)
- 420 (26 x 26) (2)
- 432 (31 x 31) (2)
- 441 (21 x 21) (2)
- 456 (26 x 26) (2)
- 48 (2 x 24) (8)
- 480 (29 x 29) (2)
- 49 (7 x 7) (2)
- 5 (1 x 5) (7)
- 50 (2 x 25) (5)
- 500 (30 x 30) (2)
- 504 (29 x 29) (2)
- 52 (2 x 26) (1)
- 520 (31 x 31) (2)
- 560 (33 x 33) (2)
- 576 (30 x 30) (2)
- 6 (1 x 6) (5)
- 6 (2 x 3) (30)
- 60 (2 x 30) (5)
- 600 (35 x 35) (2)
- 64 (1 x 64) (3)
- 64 (2 x 32) (5)
- 64 (8 x 8) (2)
- 652 (35 x 35) (2)
- 7 (1 x 7) (5)
- 8 (1 x 8) (5)
- 8 (2 x 4) (43)
- 8 (Oval) (2)
- 8 (Round) (13)
- 81 (9 x 9) (2)
- 9 (1 x 9) (3)
- 99 (1 x 99) (1)
- Contact Finish Thickness - Post :
- Applied Filters :
802 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,472
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 4POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Tin | 4 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,882
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 3POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Gold | 3 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
2,750
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 10POS | - | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon | - | Gold | - | Tin-Lead | 10 (Round) | Beryllium Copper | - | Brass | |||
|
|
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
728
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,185
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,890
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,934
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
955
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 400 (20 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 432 (31 x 31) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,125
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,593
In-stock
|
Preci-Dip | CONN SOCKET PGA 400POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 400 (20 x 20) | Beryllium Copper | Flash | Brass | |||
|
|
VIEW |
3,763
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 420 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,371
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 400 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,242
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
849
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 388 (26 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,343
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
975
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,172
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 272 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
