Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,252
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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2,133
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
1,454
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
1,350
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
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RFQ
2,467
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,438
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,345
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
604
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
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RFQ
2,836
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,541
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,316
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,295
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,927
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,073
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
706
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,322
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,486
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,714
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,951
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,079
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,124
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,062
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
VIEW
RFQ
2,801
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
VIEW
RFQ
633
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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RFQ
VIEW
RFQ
1,416
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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RFQ
VIEW
RFQ
1,231
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 432 (31 x 31) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,185
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,998
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
VIEW
RFQ
2,914
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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RFQ
VIEW
RFQ
1,125
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass