Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
2,574
In-stock
Mill-Max Manufacturing Corp. CONN ZIG-ZAG 16POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Left Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,771
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
1,176
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (1 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
607
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 217 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.75" (19.05mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
2,008
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 10 (1 x 10) Beryllium Copper 20.0µin (0.51µm) Copper
Default Photo
RFQ
VIEW
RFQ
1,845
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 16 (1 x 16) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
3,537
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 10 (1 x 10) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
1,987
In-stock
Mill-Max Manufacturing Corp. CONN ZIG-ZAG 28POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Right Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-93-640-41-001000
RFQ
VIEW
RFQ
2,798
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
117-93-764-41-005000
RFQ
VIEW
RFQ
3,094
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 117 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.75" (19.05mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-93-628-41-001000
RFQ
VIEW
RFQ
2,217
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
836
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 20 (2 x 10) Copper Alloy - Copper Alloy
Default Photo
RFQ
VIEW
RFQ
1,209
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active - - Through Hole Wire Wrap Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - Tin-Lead 24 (2 x 12) - - -
Default Photo
RFQ
VIEW
RFQ
2,717
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 28 (2 x 14) Beryllium Copper 5.00µin (0.127µm) Brass, Copper
524-AG11D-ES
RFQ
VIEW
RFQ
1,956
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 24 (2 x 12) Copper Alloy - Copper Alloy
Default Photo
RFQ
VIEW
RFQ
726
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
881
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 7POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 7 (1 x 7) Beryllium Copper 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
1,927
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 18 (2 x 9) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,297
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) Tin-Lead 16 (2 x 8) Beryllium Copper 5.00µin (0.127µm) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,786
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 14POS GOLD - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Beryllium Copper
917-93-108-41-005000
RFQ
VIEW
RFQ
2,722
In-stock
Mill-Max Manufacturing Corp. CONN TRANSIST TO-5 8POS GOLD 917 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Gold 30.0µin (0.76µm) Tin-Lead 8 (Round) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
8080-1G1
RFQ
VIEW
RFQ
3,036
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 4POS GOLD 8080 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Fluoropolymer (FP) - Gold - Tin-Lead 4 (Round) Beryllium Copper - Beryllium Copper
528-AG11D
RFQ
VIEW
RFQ
2,125
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 28 (2 x 14) Copper Alloy - Copper Alloy
508-AG11D-ES
RFQ
VIEW
RFQ
1,394
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
506-AG11D-ES
RFQ
VIEW
RFQ
2,609
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy - Copper Alloy
Default Photo
RFQ
VIEW
RFQ
1,676
In-stock
TE Connectivity AMP Connectors DIP SOCKET T/H 16POS 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 16 (2 x 8) Copper Alloy - Copper Alloy
210-93-632-41-001000
RFQ
VIEW
RFQ
2,392
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
Default Photo
RFQ
VIEW
RFQ
864
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
Default Photo
RFQ
VIEW
RFQ
2,037
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 6 (2 x 3) Copper Alloy - Copper Alloy
Default Photo
RFQ
VIEW
RFQ
2,747
In-stock
TE Connectivity AMP Connectors DIP SOCKET T/H 20POS 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Tin-Lead 20 (2 x 10) Copper Alloy - Copper Alloy