Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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3,252
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper
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RFQ
633
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
1,416
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
2,127
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
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RFQ
3,685
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
3,768
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
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RFQ
3,805
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper
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RFQ
1,101
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
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RFQ
3,597
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
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RFQ
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RFQ
1,254
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
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RFQ
2,683
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
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RFQ
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RFQ
1,460
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper
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RFQ
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RFQ
1,662
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
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RFQ
VIEW
RFQ
1,876
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
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RFQ
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RFQ
3,977
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
3,565
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
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RFQ
3,771
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
1,789
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
VIEW
RFQ
1,474
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
VIEW
RFQ
3,665
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 32 (2 x 16) Beryllium Copper
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RFQ
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RFQ
3,517
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper
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RFQ
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RFQ
1,167
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper
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RFQ
VIEW
RFQ
2,098
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper
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RFQ
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RFQ
1,618
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper
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RFQ
VIEW
RFQ
1,519
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper
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RFQ
VIEW
RFQ
3,740
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper
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RFQ
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RFQ
3,941
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 42 (2 x 21) Beryllium Copper
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RFQ
VIEW
RFQ
1,918
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
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RFQ
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RFQ
2,259
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 40 (2 x 20) Beryllium Copper
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RFQ
951
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 44 (2 x 22) Beryllium Copper