- Manufacture :
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- Texas Instruments (1)
- 3M (43)
- Aavid, Thermal Division of Boyd Corporation (2)
- Adafruit Industries LLC (1)
- Amphenol FCI (2)
- Apex Microtechnology (2)
- Aries Electronics (1553)
- Assmann WSW Components (15)
- CNC Tech (6)
- Harwin Inc. (1)
- Mill-Max Manufacturing Corp. (68)
- Omron Electronics Inc-EMC Div (11)
- On Shore Technology Inc. (7)
- Preci-Dip (109)
- TE Connectivity AMP Connectors (194)
- TE Connectivity Potter & Brumfield Relays (1)
- Series :
-
- - (1754)
- 117 (1)
- 210 (39)
- 217 (1)
- 410 (3)
- 415 (1)
- 500 (113)
- 501 (93)
- 503 (183)
- 508 (78)
- 510 (38)
- 511 (49)
- 516 (7)
- 518 (2)
- 540 (6)
- 547 (2)
- 55 (253)
- 550 (46)
- 558 (23)
- 57 (321)
- 600 (1)
- 8058 (12)
- 8059 (2)
- 8060 (7)
- 8080 (3)
- 8180 (2)
- 8400 (7)
- 917 (15)
- 940 (7)
- Apex Precision Power® (2)
- D2 (1)
- Diplomate DL (23)
- ED (7)
- EJECT-A-DIP™ (99)
- Lo-PRO®file, 513 (244)
- Lo-PRO®file, 526 (6)
- OEM (3)
- PLS (85)
- PRL (2)
- PRS (130)
- Textool™ (31)
- XR2 (11)
- Packaging :
- Termination :
- Type :
-
- BGA (46)
- CLCC (1)
- DIP, 0.1" (2.54mm) Row Spacing (1)
- DIP, 0.2" (5.08mm) Row Spacing (117)
- DIP, 0.3" (7.62mm) Row Spacing (311)
- DIP, 0.4" (10.16mm) Row Spacing (31)
- DIP, 0.6" (15.24mm) Row Spacing (375)
- DIP, 0.75" (19.05mm) Row Spacing (2)
- DIP, 0.9" (22.86mm) Row Spacing (77)
- DIP, ZIF (ZIP) (15)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (288)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (288)
- Housing (1)
- PGA (58)
- PGA, ZIF (ZIP) (220)
- PLCC (49)
- QFN (6)
- QFP (4)
- SIP (48)
- SOIC (9)
- SOIC, ZIF (ZIP) (2)
- Transistor, TO-100 (4)
- Transistor, TO-3 (9)
- Transistor, TO-3 and TO-66 (1)
- Transistor, TO-5 (35)
- Zig-Zag (3)
- Zig-Zag, Left Stackable (2)
- Zig-Zag, Right Stackable (1)
- Zig-Zag, ZIF (ZIP) (12)
- Housing Material :
-
- Diallyl Phthalate (DAP) (1)
- Fluoropolymer (FP) (5)
- FR4 Epoxy Glass (71)
- Liquid Crystal Polymer (LCP) (6)
- Phenolic (2)
- Polyamide (PA), Nylon (1)
- Polyamide (PA), Nylon, Glass Filled (4)
- Polyamide (PA46), Nylon 4/6 (78)
- Polyamide (PA46), Nylon 4/6, Glass Filled (681)
- Polybutylene Terephthalate (PBT) (21)
- Polybutylene Terephthalate (PBT), Glass Filled (24)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (114)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (32)
- Polyester (34)
- Polyester, Glass Filled (3)
- Polyether Imide (PEI), Glass Filled (2)
- Polyetheretherketone (PEEK), Glass Filled (64)
- Polyethersulfone (PES) (6)
- Polyethersulfone (PES), Glass Filled (9)
- Polyphenylene Sulfide (PPS) (227)
- Polyphenylene Sulfide (PPS), Glass Filled (514)
- Polysulfone (PSU), Glass Filled (17)
- Polytetrafluoroethylene (PTFE) (18)
- Thermoplastic (6)
- Thermoplastic, Glass Filled (22)
- Thermoplastic, Polyester (17)
- Thermoplastic, Polyester, Glass Filled (1)
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (8)
- 10 (2 x 5) (52)
- 10 (Round) (5)
- 100 (10 x 10) (2)
- 11 (1 x 11) (1)
- 12 (1 x 12) (2)
- 12 (2 x 6) (23)
- 121 (11 x 11) (2)
- 13 (1 x 13) (1)
- 132 (4 x 33) (3)
- 14 (1 x 14) (3)
- 14 (2 x 7) (62)
- 144 (12 x 12) (2)
- 145 (15 x 15) (1)
- 15 (1 x 15) (3)
- 16 (1 x 16) (4)
- 16 (2 x 8) (76)
- 160 (4 x 40) (1)
- 169 (13 x 13) (2)
- 17 (1 x 17) (1)
- 18 (2 x 9) (39)
- 192 (16 x 16) (3)
- 196 (14 x 14) (2)
- 2 (1 x 2) (5)
- 20 (1 x 20) (13)
- 20 (2 x 10) (59)
- 20 (4 x 5) (6)
- 20 (Round) (1)
- 21 (1 x 21) (1)
- 22 (1 x 22) (1)
- 22 (2 x 11) (45)
- 225 (15 x 15) (2)
- 23 (1 x 23) (1)
- 24 (2 x 12) (148)
- 25 (5 x 5) (2)
- 255 (16 x 16) (3)
- 256 (16 x 16) (6)
- 256 (20 x 20) (3)
- 26 (2 x 13) (14)
- 272 (20 x 20) (3)
- 28 (2 x 14) (147)
- 28 (4 x 7) (6)
- 289 (17 x 17) (2)
- 29 (1 x 29) (1)
- 292 (20 x 20) (3)
- 3 (1 x 3) (1)
- 3 (Oval) (2)
- 3 (Rectangular) (1)
- 3 (Round) (10)
- 30 (2 x 15) (37)
- 32 (1 x 32) (2)
- 32 (2 x 16) (149)
- 32 (2 x 7, 2 x 9) (3)
- 32 (4 x 8) (5)
- 324 (18 x 18) (2)
- 34 (1 x 34) (1)
- 34 (2 x 17) (22)
- 35 (1 x 17, 1 x 18) (4)
- 352 (26 x 26) (3)
- 356 (26 x 26) (3)
- 357 (19 x 19) (3)
- 36 (2 x 18) (99)
- 36 (6 x 6) (2)
- 360 (19 x 19) (3)
- 361 (19 x 19) (2)
- 38 (2 x 19) (19)
- 388 (26 x 26) (3)
- 39 (1 x 19, 1 x 20) (2)
- 4 (2 x 2) (6)
- 4 (Oval) (2)
- 4 (Round) (9)
- 40 (2 x 20) (145)
- 40 (4 x 10) (2)
- 400 (20 x 20) (4)
- 42 (2 x 21) (74)
- 420 (26 x 26) (3)
- 432 (31 x 31) (3)
- 44 (2 x 22) (75)
- 44 (4 x 11) (6)
- 441 (21 x 21) (2)
- 456 (26 x 26) (3)
- 48 (2 x 24) (87)
- 48 (4 x 12) (3)
- 480 (29 x 29) (3)
- 49 (7 x 7) (2)
- 5 (1 x 5) (1)
- 50 (2 x 25) (9)
- 500 (30 x 30) (3)
- 504 (29 x 29) (3)
- 51 (1 x 25, 1 x 26) (4)
- 52 (2 x 26) (2)
- 52 (4 x 13) (6)
- 520 (31 x 31) (3)
- 56 (2 x 28) (1)
- 560 (33 x 33) (3)
- 576 (30 x 30) (3)
- 6 (1 x 6) (1)
- 6 (2 x 3) (38)
- 60 (2 x 30) (9)
- 600 (35 x 35) (3)
- 64 (2 x 32) (14)
- 64 (8 x 8) (2)
- 652 (35 x 35) (3)
- 68 (2 x 34) (1)
- 68 (4 x 17) (7)
- 7 (1 x 7) (1)
- 72 (2 x 36) (1)
- 8 (2 x 4) (72)
- 8 (Oval) (2)
- 8 (Round) (17)
- 81 (9 x 9) (2)
- 84 (2x42) (1)
- 84 (4 x 21) (6)
- 90 (2 x 45) (1)
- 99 (1 x 99) (1)
- Contact Material - Mating :
- Pitch - Post :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
2016 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
2,828
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,829
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 132POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 132 (4 x 33) | Phosphor Bronze | 0.025" (0.64mm) | 200.0µin (5.08µm) | Phosphor Bronze | |||
|
|
VIEW |
2,133
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,454
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
1,350
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
2,467
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,438
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 652 (35 x 35) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,345
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
604
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,836
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,541
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,316
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 600 (35 x 35) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,295
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 560 (33 x 33) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,927
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,073
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
706
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 576 (30 x 30) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,322
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 520 (31 x 31) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,486
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,714
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 504 (29 x 29) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,951
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 500 (30 x 30) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,079
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 456 (26 x 26) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,124
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 480 (29 x 29) | Brass | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,062
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PRS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
2,801
In-stock
|
Aries Electronics | CONN SOCKET PGA ZIF GOLD | PLS | Active | Bulk | -65°C ~ 200°C | Through Hole | Solder | Closed Frame | PGA, ZIF (ZIP) | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Nickel Bronze | - | Beryllium Copper | 0.100" (2.54mm) | 50.0µin (1.27µm) | Beryllium Copper | |||
|
|
VIEW |
633
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,784
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,416
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,639
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS TIN | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Beryllium Copper | |||
|
|
VIEW |
1,231
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 432 (31 x 31) | Beryllium Copper | 0.050" (1.27mm) | 10.0µin (0.25µm) | Brass | |||
