Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,467
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Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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3,438
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Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Brass 10.0µin (0.25µm) Brass
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3,345
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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604
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Brass 10.0µin (0.25µm) Brass
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RFQ
2,836
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
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1,541
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Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,316
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Brass 10.0µin (0.25µm) Brass
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1,295
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,927
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
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RFQ
2,073
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
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RFQ
706
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,322
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,486
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,714
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,951
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Brass 10.0µin (0.25µm) Brass
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RFQ
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RFQ
2,079
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
2,124
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 480 (29 x 29) Brass 10.0µin (0.25µm) Brass
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RFQ
1,231
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Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 432 (31 x 31) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,185
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 456 (26 x 26) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,125
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,593
In-stock
Preci-Dip CONN SOCKET PGA 400POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 400 (20 x 20) Beryllium Copper Flash Brass
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RFQ
VIEW
RFQ
3,763
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 420 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
765
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 432 (31 x 31) Brass 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,371
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 400 (20 x 20) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,703
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 420 (26 x 26) Brass 10.0µin (0.25µm) Brass
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RFQ
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RFQ
1,242
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
849
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 388 (26 x 26) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
1,343
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
3,086
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 400 (20 x 20) Brass 10.0µin (0.25µm) Brass
Default Photo
RFQ
VIEW
RFQ
975
In-stock
Preci-Dip BGA PIN ADAPTER 1.27MM SMD 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 10.0µin (0.25µm) Brass