Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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875
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Mill-Max Manufacturing Corp. CONN SOCKET PGA 145POS GOLD 510 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 145 (15 x 15) Beryllium Copper - Brass Alloy
415-13-272-41-003000
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3,288
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 72POS GOLD 415 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 72 (2 x 36) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,973
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,536
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-13-624-41-001000
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816
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-324-41-001000
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2,539
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 24 (2 x 12) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-640-41-001000
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2,192
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-314-41-001000
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1,814
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (2 x 7) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-99-640-41-001000
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1,359
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-99-628-41-001000
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762
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,839
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS TIN-LEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,574
In-stock
Mill-Max Manufacturing Corp. CONN ZIG-ZAG 16POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Left Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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737
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 25.0µin (0.63µm) Nickel
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2,771
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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760
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 20 (2 x 10) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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3,628
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (2 x 10) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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607
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 217 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.75" (19.05mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-99-314-41-001000
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1,133
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
2-1571550-8
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2,783
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
210-99-632-41-001000
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2,322
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
5-1571551-0
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3,681
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Nickel
2-1571550-3
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2,428
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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2,920
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-99-316-41-001000
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3,422
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS TINLEAD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-13-632-41-001000
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2,574
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 32 (2 x 16) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
210-13-628-41-001000
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823
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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1,987
In-stock
Mill-Max Manufacturing Corp. CONN ZIG-ZAG 28POS GOLD 410 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, Right Stackable Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-93-640-41-001000
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2,798
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 210 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
4-1571551-3
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2,317
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 14 (2 x 7) Beryllium Copper 25.0µin (0.63µm) Nickel
506-AG11D-ESL-LF
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2,006
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Gold 6 (2 x 3) Beryllium Copper Flash Nickel