Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
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1,456
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 50 (2 x 25) Beryllium Copper Phosphor Bronze
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RFQ
1,908
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 50 (2 x 25) Beryllium Copper Phosphor Bronze