Contact Finish - Mating :
Contact Finish - Post :
Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,753
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Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 361 (18 x 18) Beryllium Copper 0.050" (1.27mm) - Brass
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3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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3,631
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Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
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2,828
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper
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3,252
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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2,829
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TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.025" (0.64mm) 200.0µin (5.08µm) Phosphor Bronze
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3,999
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Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
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3,130
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3M CONN SOCKET BGA CUSTOM Textool™ Active - - Through Hole - Custom BGA - 0.026" ~ 0.050" (0.65mm ~ 1.27mm) Custom Custom - Custom - - - -
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2,133
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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3,049
In-stock
Preci-Dip CONN SOCKET PGA 652POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) Flash Brass
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1,454
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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1,350
In-stock
Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 0.100" (2.54mm) 50.0µin (1.27µm) Beryllium Copper
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2,467
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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1,026
In-stock
Preci-Dip CONN SOCKET PGA 600POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 600 (35 x 35) Beryllium Copper 0.050" (1.27mm) Flash Brass
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3,438
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 652 (35 x 35) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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3,945
In-stock
Preci-Dip CONN SOCKET PGA 576POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 576 (30 x 30) Beryllium Copper 0.050" (1.27mm) Flash Brass
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3,345
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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3,235
In-stock
Preci-Dip CONN SOCKET PGA 560POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 560 (33 x 33) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
604
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
2,836
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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1,541
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
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RFQ
1,316
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 600 (35 x 35) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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717
In-stock
Preci-Dip CONN SOCKET PGA 480POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 480 (29 x 29) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
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RFQ
3,800
In-stock
Preci-Dip CONN SOCKET PGA 478POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 478 (26 x 26) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
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RFQ
1,295
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 560 (33 x 33) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
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RFQ
1,927
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 504 (29 x 29) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
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RFQ
3,755
In-stock
Preci-Dip CONN SOCKET PGA 520POS GOLD 518 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold Flash Gold 520 (31 x 31) Beryllium Copper 0.050" (1.27mm) Flash Brass
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RFQ
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RFQ
2,073
In-stock
Preci-Dip PGA SOLDER TAIL 1.27MM 558 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame PGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 500 (30 x 30) Beryllium Copper 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
VIEW
RFQ
706
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 576 (30 x 30) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass
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RFQ
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RFQ
3,322
In-stock
Preci-Dip BGA SOLDER TAIL 550 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame BGA FR4 Epoxy Glass 0.050" (1.27mm) Gold 10.0µin (0.25µm) Gold 520 (31 x 31) Brass 0.050" (1.27mm) 10.0µin (0.25µm) Brass