Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,133
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,454
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,350
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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3,062
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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2,801
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,998
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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2,914
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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2,196
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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925
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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3,086
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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3,023
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,693
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,994
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,068
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,176
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,719
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,883
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,941
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,951
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,568
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,992
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,057
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,339
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,617
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,996
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,786
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Aries Electronics CONN SOCKET PGA ZIF GOLD PLS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,113
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,295
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRL Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,948
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 200°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Nickel Bronze - Beryllium Copper 50.0µin (1.27µm) Beryllium Copper
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1,756
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Aries Electronics CONN SOCKET PGA ZIF GOLD PRS Active Bulk -65°C ~ 125°C Through Hole Solder Closed Frame PGA, ZIF (ZIP) Polyphenylene Sulfide (PPS) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin - Beryllium Copper 200.0µin (5.08µm) Beryllium Copper