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16 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
905
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,665
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,218
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,911
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,039
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
917
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,426
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,510
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,549
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,411
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,985
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,750
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
3,958
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,052
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,030
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,040
In-stock
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Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
