- Packaging :
- Termination :
- Type :
-
- DIP, 0.2" (5.08mm) Row Spacing (16)
- DIP, 0.3" (7.62mm) Row Spacing (95)
- DIP, 0.4" (10.16mm) Row Spacing (13)
- DIP, 0.6" (15.24mm) Row Spacing (79)
- DIP, 0.9" (22.86mm) Row Spacing (42)
- DIP, ZIF (ZIP) (8)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (80)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (63)
- QFN (6)
- SIP (15)
- SOIC, ZIF (ZIP) (2)
- Transistor, TO-3 (1)
- Transistor, TO-5 (1)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (4)
- 10 (2 x 5) (21)
- 11 (1 x 11) (1)
- 12 (1 x 12) (1)
- 12 (2 x 6) (11)
- 14 (2 x 7) (11)
- 16 (1 x 16) (2)
- 16 (2 x 8) (10)
- 18 (2 x 9) (11)
- 2 (1 x 2) (5)
- 20 (1 x 20) (4)
- 20 (2 x 10) (15)
- 22 (2 x 11) (11)
- 24 (2 x 12) (31)
- 26 (2 x 13) (6)
- 28 (2 x 14) (33)
- 30 (2 x 15) (15)
- 32 (2 x 16) (29)
- 32 (4 x 8) (1)
- 34 (2 x 17) (5)
- 36 (2 x 18) (23)
- 38 (2 x 19) (5)
- 4 (2 x 2) (2)
- 40 (2 x 20) (40)
- 40 (4 x 10) (2)
- 42 (2 x 21) (15)
- 44 (2 x 22) (16)
- 48 (2 x 24) (33)
- 48 (4 x 12) (3)
- 50 (2 x 25) (5)
- 52 (2 x 26) (1)
- 6 (2 x 3) (15)
- 60 (2 x 30) (5)
- 64 (2 x 32) (5)
- 7 (1 x 7) (1)
- 8 (2 x 4) (20)
- 8 (Oval) (1)
- 8 (Round) (1)
- Contact Material - Post :
- Applied Filters :
421 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
633
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,416
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,127
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,768
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,805
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,101
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,597
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,254
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,683
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,460
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,748
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
1,662
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,876
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,977
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,565
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
656
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
2,820
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
3,945
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
3,179
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
2,688
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
3,835
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
2,975
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 44POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
3,771
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,789
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
1,474
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
3,665
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 32POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
|
VIEW |
2,115
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 40POS GLD | 55 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | - | Gold | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | - | Beryllium Copper | |||
|
|
VIEW |
3,517
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
