- Packaging :
- Termination :
- Type :
-
- BGA (1)
- DIP, 0.2" (5.08mm) Row Spacing (142)
- DIP, 0.3" (7.62mm) Row Spacing (236)
- DIP, 0.4" (10.16mm) Row Spacing (50)
- DIP, 0.6" (15.24mm) Row Spacing (224)
- DIP, 0.75" (19.05mm) Row Spacing (1)
- DIP, 0.9" (22.86mm) Row Spacing (63)
- DIP, 1.2" (30.48mm) Row Spacing (1)
- DIP, ZIF (ZIP) (8)
- DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing (80)
- DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing (63)
- PGA (12)
- PGA, ZIF (ZIP) (3)
- QFN (15)
- SIP (444)
- SOIC, ZIF (ZIP) (2)
- Transistor, TO-3 (1)
- Transistor, TO-5 (1)
- Zig-Zag (1)
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (3)
- Polyamide (PA), Nylon, Glass Filled (100)
- Polyamide (PA46), Nylon 4/6, Glass Filled (925)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polyester, Glass Filled (4)
- Polyethersulfone (PES) (15)
- Polyphenylene Sulfide (PPS), Glass Filled (205)
- Thermoplastic (68)
- Thermoplastic, Polyester (7)
- Thermoplastic, Polyester, Glass Filled (11)
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 1 (1 x 1) (14)
- 10 (1 x 10) (19)
- 10 (2 x 5) (32)
- 11 (1 x 11) (15)
- 114 (13 x 13) (2)
- 12 (1 x 12) (16)
- 12 (2 x 6) (19)
- 128 (13 x 13) (1)
- 13 (1 x 13) (14)
- 132 (14 x 14) (1)
- 14 (1 x 14) (14)
- 14 (2 x 7) (35)
- 144 (15 x 15) (1)
- 15 (1 x 15) (14)
- 16 (1 x 16) (17)
- 16 (2 x 8) (34)
- 16 (4 x 4) (1)
- 168 (17 x 17) (1)
- 169 (17 x 17) (1)
- 17 (1 x 17) (14)
- 18 (1 x 18) (14)
- 18 (2 x 9) (34)
- 181 (15 x 15) (2)
- 19 (1 x 19) (14)
- 2 (1 x 2) (25)
- 20 (1 x 20) (18)
- 20 (2 x 10) (50)
- 209 (17 x 17) (1)
- 21 (1 x 21) (14)
- 22 (1 x 22) (14)
- 22 (2 x 11) (31)
- 223 (18 x 18) (1)
- 23 (1 x 23) (14)
- 24 (1 x 24) (14)
- 24 (2 x 12) (94)
- 24 (4 x 6) (1)
- 241 (18 x 18) (2)
- 25 (1 x 25) (13)
- 26 (1 x 26) (5)
- 26 (2 x 13) (13)
- 27 (1 x 27) (5)
- 28 (1 x 28) (5)
- 28 (2 x 14) (85)
- 28 (4 x 7) (1)
- 29 (1 x 29) (5)
- 3 (1 x 3) (14)
- 30 (1 x 30) (5)
- 30 (2 x 15) (21)
- 31 (1 x 31) (5)
- 32 (1 x 32) (5)
- 32 (2 x 16) (61)
- 32 (4 x 8) (1)
- 33 (1 x 33) (5)
- 34 (1 x 34) (5)
- 34 (2 x 17) (11)
- 35 (1 x 35) (5)
- 36 (1 x 36) (5)
- 36 (2 x 18) (39)
- 37 (1 x 37) (5)
- 370 (19 x 19) (4)
- 38 (1 x 38) (5)
- 38 (2 x 19) (11)
- 39 (1 x 39) (5)
- 4 (1 x 4) (14)
- 4 (2 x 2) (10)
- 40 (1 x 40) (6)
- 40 (2 x 20) (67)
- 40 (4 x 10) (2)
- 42 (2 x 21) (26)
- 44 (2 x 22) (26)
- 48 (2 x 24) (50)
- 48 (4 x 12) (3)
- 5 (1 x 5) (14)
- 50 (2 x 25) (16)
- 52 (2 x 26) (5)
- 56 (4 x 14) (1)
- 58 (2 x 29) (1)
- 6 (1 x 6) (14)
- 6 (2 x 3) (31)
- 60 (2 x 30) (5)
- 60 (4 x 15) (2)
- 64 (2 x 32) (16)
- 64 (4 x 16) (1)
- 7 (1 x 7) (15)
- 8 (1 x 8) (14)
- 8 (2 x 4) (38)
- 8 (Oval) (1)
- 8 (Round) (1)
- 80 (4 x 20) (1)
- 88 (4 x 22) (1)
- 9 (1 x 9) (15)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Contact Material - Post :
- Applied Filters :
1349 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,252
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 28POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
633
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,416
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,294
In-stock
|
TE Connectivity AMP Connectors | CONN ZIGZAG 370POS GOLD | PKA | Active | Tube | - | Through Hole | Solder | Open Frame | Zig-Zag | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 370 (19 x 19) | Beryllium Copper | 0.100" (2.54mm) | - | Brass | |||
|
VIEW |
1,057
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,947
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
2,127
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,685
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,768
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,805
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 48POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,308
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,396
In-stock
|
Samtec Inc. | CONN ADAPTER PLUG 28POS GOLD | APA | Active | Bulk | - | Through Hole | Solder | Open Frame | - | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 0.100" (2.54mm) | 20.0µin (0.51µm) | Phosphor Bronze | |||
|
VIEW |
3,170
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 241POS GOLD | PKA | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 241 (18 x 18) | Copper Alloy | 0.100" (2.54mm) | 118.1µin (3.00µm) | Phosphor Bronze | |||
|
VIEW |
1,937
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 48 (2 x 24) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
3,492
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 28 (2 x 14) | Brass | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,319
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
2,738
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 48POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 48 (2 x 24) | Brass | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,755
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,211
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
632
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 44POS GOLD | 6556 | Active | Bulk | - | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 44 (2 x 22) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,359
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | - | Active | Bulk | - | Through Hole | Solder | Spacer | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 32 (2 x 16) | Brass | 0.100" (2.54mm) | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,239
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 42 (2 x 21) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass | |||
|
VIEW |
1,101
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
3,597
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,254
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
2,683
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
1,460
In-stock
|
Aries Electronics | CONN IC DIP SOCKET ZIF 36POS GLD | 57 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Beryllium Copper | |||
|
VIEW |
2,248
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 64POS GOLD | 104 | Active | Tube | - | Through Hole | Press-Fit | Open Frame | DIP, 0.9" (22.86mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 64 (2 x 32) | Beryllium Copper | 0.100" (2.54mm) | 10.0µin (0.25µm) | Brass Alloy |