Contact Finish - Post :
Number of Positions or Pins (Grid) :
Contact Material - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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3,252
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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633
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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1,416
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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1,964
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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1,294
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TE Connectivity AMP Connectors CONN ZIGZAG 370POS GOLD PKA Active Tube - Through Hole Solder Open Frame Zig-Zag Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 370 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
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1,057
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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2,947
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Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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2,127
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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3,685
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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3,768
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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3,805
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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3,308
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Aries Electronics CONN IC DIP SOCKET 36POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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1,396
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Samtec Inc. CONN ADAPTER PLUG 28POS GOLD APA Active Bulk - Through Hole Solder Open Frame - Polybutylene Terephthalate (PBT), Glass Filled 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 28 (2 x 14) Phosphor Bronze 0.100" (2.54mm) 20.0µin (0.51µm) Phosphor Bronze
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3,170
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TE Connectivity AMP Connectors CONN SOCKET PGA 241POS GOLD PKA Active Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 241 (18 x 18) Copper Alloy 0.100" (2.54mm) 118.1µin (3.00µm) Phosphor Bronze
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1,937
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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3,492
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 28 (2 x 14) Brass 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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3,319
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Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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2,738
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Aries Electronics CONN IC DIP SOCKET 48POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 48 (2 x 24) Brass 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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3,755
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Aries Electronics CONN IC DIP SOCKET 40POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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1,211
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Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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632
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Aries Electronics CONN IC DIP SOCKET 44POS GOLD 6556 Active Bulk - Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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1,359
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Aries Electronics CONN IC DIP SOCKET 32POS GOLD - Active Bulk - Through Hole Solder Spacer DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 32 (2 x 16) Brass 0.100" (2.54mm) 200.0µin (5.08µm) Brass
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3,239
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Aries Electronics CONN IC DIP SOCKET 42POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 42 (2 x 21) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass
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1,101
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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3,597
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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1,254
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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2,683
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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1,460
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Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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2,248
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 64 (2 x 32) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy