Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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1,748
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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656
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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RFQ
2,820
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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RFQ
3,945
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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RFQ
3,179
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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RFQ
2,688
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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RFQ
3,835
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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RFQ
2,975
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 44 (2 x 22) Beryllium Copper
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2,115
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper
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RFQ
1,308
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
2,376
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
3,434
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
3,117
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
3,302
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 32POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper
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RFQ
1,619
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
3,611
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
1,552
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
3,687
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
645
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
1,977
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 48POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 48 (2 x 24) Beryllium Copper
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RFQ
1,199
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 24 (2 x 12) Beryllium Copper
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RFQ
1,753
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 24POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 24 (2 x 12) Beryllium Copper
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RFQ
1,971
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
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RFQ
1,768
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
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RFQ
3,043
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
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RFQ
3,007
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 36POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 36 (2 x 18) Beryllium Copper
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RFQ
2,599
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper
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RFQ
3,034
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper
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RFQ
1,501
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper
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RFQ
2,573
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 40POS GLD 55 Active Bulk Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper