Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,008
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin-Lead 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper
1-1571994-0
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1,957
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 10 (1 x 10) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper
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849
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) 47.2µin (1.20µm) Copper Alloy
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1,886
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TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD - Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 12 (1 x 12) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper
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3,127
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TE Connectivity AMP Connectors CONN SOCKET SIP 16POS GOLD - Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 16 (1 x 16) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper
44-547-11
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2,674
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Aries Electronics CONN SOCKET SOIC ZIF 44POS GOLD 547 Active Bulk - Through Hole Solder Closed Frame SOIC, ZIF (ZIP) Polyphenylene Sulfide (PPS), Glass Filled - Gold 20.0µin (0.51µm) Gold 44 (2 x 22) Beryllium Copper 0.050" (1.27mm) 20.0µin (0.51µm) Beryllium Copper
44-547-11E
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3,410
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Aries Electronics CONN SOCKET SOIC ZIF 44POS GOLD 547 Active Bulk - Through Hole Solder Closed Frame SOIC, ZIF (ZIP) Polyphenylene Sulfide (PPS), Glass Filled - Gold 20.0µin (0.51µm) Gold 44 (2 x 22) Beryllium Copper 0.050" (1.27mm) 20.0µin (0.51µm) Beryllium Copper
2-1571994-0
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3,988
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TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper
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1,577
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 6 (2 x 3) Beryllium Copper 0.100" (2.54mm) 47.2µin (1.20µm) Copper Alloy
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1,583
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TE Connectivity AMP Connectors CONN SOCKET SIP 2POS GOLD 510 Active Bulk - Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Tin 2 (1 x 2) Beryllium Copper 0.100" (2.54mm) 20.0µin (0.51µm) Copper