- Packaging :
- Termination :
- Housing Material :
-
- Liquid Crystal Polymer (LCP) (6)
- Polyamide (PA46), Nylon 4/6, Glass Filled (911)
- Polybutylene Terephthalate (PBT) (44)
- Polybutylene Terephthalate (PBT), Glass Filled (42)
- Polyester, Glass Filled (26)
- Polyphenylene Sulfide (PPS) (6)
- Thermoplastic, Glass Filled (17)
- Thermoplastic, Polyester (1)
- Thermoplastic, Polyester, Glass Filled (9)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (21)
- 10 (2 x 5) (27)
- 11 (1 x 11) (10)
- 114 (13 x 13) (1)
- 12 (1 x 12) (14)
- 12 (2 x 6) (8)
- 128 (13 x 13) (1)
- 13 (1 x 13) (9)
- 132 (14 x 14) (1)
- 132 (4 x 33) (3)
- 14 (1 x 14) (13)
- 14 (2 x 7) (56)
- 15 (1 x 15) (14)
- 16 (1 x 16) (12)
- 16 (2 x 8) (36)
- 160 (4 x 40) (1)
- 169 (17 x 17) (1)
- 17 (1 x 17) (14)
- 18 (1 x 18) (12)
- 18 (2 x 9) (31)
- 181 (15 x 15) (1)
- 19 (1 x 19) (12)
- 2 (1 x 2) (18)
- 20 (1 x 20) (66)
- 20 (2 x 10) (30)
- 20 (4 x 5) (4)
- 209 (17 x 17) (1)
- 21 (1 x 21) (11)
- 22 (1 x 22) (8)
- 22 (2 x 11) (28)
- 223 (18 x 18) (1)
- 23 (1 x 23) (8)
- 24 (1 x 24) (9)
- 24 (2 x 12) (25)
- 241 (18 x 18) (2)
- 25 (1 x 25) (26)
- 26 (1 x 26) (11)
- 26 (2 x 13) (4)
- 27 (1 x 27) (12)
- 28 (1 x 28) (11)
- 28 (2 x 14) (31)
- 28 (4 x 7) (4)
- 29 (1 x 29) (11)
- 3 (1 x 3) (11)
- 30 (1 x 30) (19)
- 30 (2 x 15) (18)
- 31 (1 x 31) (10)
- 32 (1 x 32) (8)
- 32 (2 x 16) (26)
- 32 (4 x 8) (4)
- 33 (1 x 33) (7)
- 34 (1 x 34) (22)
- 34 (2 x 17) (10)
- 35 (1 x 35) (10)
- 36 (1 x 36) (7)
- 36 (2 x 18) (14)
- 37 (1 x 37) (7)
- 38 (1 x 38) (7)
- 38 (2 x 19) (10)
- 39 (1 x 39) (7)
- 4 (1 x 4) (28)
- 40 (1 x 40) (9)
- 40 (2 x 20) (27)
- 42 (2 x 21) (3)
- 44 (2 x 22) (1)
- 44 (4 x 11) (3)
- 48 (2 x 24) (14)
- 5 (1 x 5) (13)
- 50 (2 x 25) (4)
- 52 (2 x 26) (1)
- 52 (4 x 13) (4)
- 6 (1 x 6) (12)
- 6 (2 x 3) (15)
- 60 (2 x 30) (4)
- 64 (2 x 32) (4)
- 68 (2 x 34) (1)
- 68 (4 x 17) (4)
- 7 (1 x 7) (7)
- 8 (1 x 8) (30)
- 8 (2 x 4) (38)
- 84 (2x42) (1)
- 84 (4 x 21) (4)
- 9 (1 x 9) (19)
- Contact Material - Mating :
- Contact Finish Thickness - Post :
- Applied Filters :
1062 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
|
VIEW |
2,829
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PQFP 132POS TIN-LEAD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | QFP | Liquid Crystal Polymer (LCP) | 0.025" (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 132 (4 x 33) | Phosphor Bronze | 200.0µin (5.08µm) | |||
|
|
VIEW |
1,396
In-stock
|
Samtec Inc. | CONN ADAPTER PLUG 28POS GOLD | APA | Active | Bulk | - | Through Hole | Solder | Open Frame | - | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 20.0µin (0.51µm) | |||
|
|
VIEW |
3,170
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET PGA 241POS GOLD | PKA | Active | Bulk | - | Through Hole | Press-Fit | Open Frame | PGA | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 241 (18 x 18) | Copper Alloy | 118.1µin (3.00µm) | |||
|
|
VIEW |
1,456
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
1,908
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 50 (2 x 25) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,218
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,867
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 64POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 64 (2 x 32) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,000
In-stock
|
Aries Electronics | CONN SOCKET SIP 40POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (1 x 40) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,107
In-stock
|
Aries Electronics | CONN SOCKET SIP 37POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 37 (1 x 37) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,283
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,944
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,837
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,019
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 60 (2 x 30) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,222
In-stock
|
Aries Electronics | CONN SOCKET SIP 37POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 37 (1 x 37) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
1,100
In-stock
|
Aries Electronics | CONN SOCKET SIP 37POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 37 (1 x 37) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,476
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,509
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,774
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,593
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
1,798
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
1,132
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,043
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,886
In-stock
|
Aries Electronics | CONN SOCKET SIP 40POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (1 x 40) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
828
In-stock
|
Aries Electronics | CONN SOCKET SIP 40POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (1 x 40) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,539
In-stock
|
Aries Electronics | CONN SOCKET SIP 36POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (1 x 36) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,183
In-stock
|
Aries Electronics | CONN SOCKET SIP 36POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (1 x 36) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,842
In-stock
|
Aries Electronics | CONN SOCKET SIP 29POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 29 (1 x 29) | Phosphor Bronze | 10.0µin (0.25µm) | |||
|
|
VIEW |
2,692
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
3,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
|
VIEW |
1,306
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | |||
