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15 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
1,728
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
1,469
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
1,821
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
956
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
669
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 6POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 6 (2 x 3) | Phosphor Bronze | - | |||
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VIEW |
3,571
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | |||
|
VIEW |
724
In-stock
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CNC Tech | CONN IC DIP SOCKET 6POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 6 (2 x 3) | Phosphor Bronze | 60.0µin (1.52µm) | |||
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VIEW |
2,574
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | |||
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|
VIEW |
3,240
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | |||
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|
VIEW |
3,884
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | |||
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|
VIEW |
979
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
1,369
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
2,371
In-stock
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Aries Electronics | CONN IC DIP SOCKET 6POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 6 (2 x 3) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
3,487
In-stock
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On Shore Technology Inc. | CONN IC DIP SOCKET 6POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 6 (2 x 3) | Phosphor Bronze | 60.0µin (1.52µm) | |||
|
VIEW |
3,067
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 6POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 6 (2 x 3) | Phosphor Bronze | - | |||
