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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Series	Part Status	Packaging	Operating Temperature	Mounting Type	Termination	Features	Type	Housing Material	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish Thickness - Post
GLOBAL STOCKS
	16-6511-11WR	RFQ VIEW	PDF RFQ	2,498 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	511	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-6503-30	RFQ VIEW	PDF RFQ	3,912 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)
	16-6503-20	RFQ VIEW	PDF RFQ	3,215 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)
	16-8430-10WR	RFQ VIEW	PDF RFQ	2,014 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-6501-31	RFQ VIEW	PDF RFQ	1,097 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-6501-21	RFQ VIEW	PDF RFQ	3,830 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-3501-31	RFQ VIEW	PDF RFQ	3,470 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-3501-21	RFQ VIEW	PDF RFQ	2,318 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-6503-31	RFQ VIEW	PDF RFQ	2,037 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	10.0µin (0.25µm)
	16-6503-21	RFQ VIEW	PDF RFQ	1,773 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	10.0µin (0.25µm)
	16-3503-31	RFQ VIEW	PDF RFQ	2,940 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	10.0µin (0.25µm)
	16-3503-21	RFQ VIEW	PDF RFQ	2,349 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	10.0µin (0.25µm)
	241-16-1-03	RFQ VIEW	PDF RFQ	1,806 In-stock	CNC Tech	CONN IC DIP SOCKET 16POS TIN	-	Active	Tube	-40°C ~ 105°C	Through Hole	Solder	Open Frame	DIP, 0.3" (7.62mm) Row Spacing	Polybutylene Terephthalate (PBT), Glass Filled	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	16 (2 x 8)	Phosphor Bronze	60.0µin (1.52µm)
	16-6511-11	RFQ VIEW	PDF RFQ	2,408 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	511	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-3501-30	RFQ VIEW	PDF RFQ	3,829 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-3501-20	RFQ VIEW	PDF RFQ	3,026 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	501	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	2-641262-4	RFQ VIEW	PDF RFQ	3,214 In-stock	TE Connectivity AMP Connectors	CONN IC DIP SOCKET 16POS GOLD	Diplomate DL	Active	Tube	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Thermoplastic, Glass Filled	0.100" (2.54mm)	Gold	30.0µin (0.76µm)	16 (2 x 8)	Phosphor Bronze	30.0µin (0.76µm)
	16-3511-10WR	RFQ VIEW	PDF RFQ	1,689 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	511	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-3511-10	RFQ VIEW	PDF RFQ	2,581 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	511	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-3511-11	RFQ VIEW	PDF RFQ	3,376 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	511	Active	Bulk	-55°C ~ 125°C	Through Hole	Solder	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Phosphor Bronze	10.0µin (0.25µm)
	16-6501-30	RFQ VIEW	PDF RFQ	3,769 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	501	Active	Bulk	-55°C ~ 125°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-6501-20	RFQ VIEW	PDF RFQ	2,470 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	501	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-3503-30	RFQ VIEW	PDF RFQ	3,920 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)
	16-3503-20	RFQ VIEW	PDF RFQ	876 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS GOLD	503	Active	Bulk	-55°C ~ 105°C	Through Hole	Wire Wrap	Closed Frame	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Gold	10.0µin (0.25µm)	16 (2 x 8)	Beryllium Copper	200.0µin (5.08µm)
	16-8810-10	RFQ VIEW	PDF RFQ	1,776 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-8700-10	RFQ VIEW	PDF RFQ	1,056 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-8480-10	RFQ VIEW	PDF RFQ	2,566 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-8430-10	RFQ VIEW	PDF RFQ	1,120 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-81250-10	RFQ VIEW	PDF RFQ	3,118 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	8	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame, Elevated	DIP, 0.3" (7.62mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)
	16-6511-10	RFQ VIEW	PDF RFQ	2,045 In-stock	Aries Electronics	CONN IC DIP SOCKET 16POS TIN	511	Active	Bulk	-55°C ~ 105°C	Through Hole	Solder	Closed Frame	DIP, 0.6" (15.24mm) Row Spacing	Polyamide (PA46), Nylon 4/6, Glass Filled	0.100" (2.54mm)	Tin	200.0µin (5.08µm)	16 (2 x 8)	Phosphor Bronze	200.0µin (5.08µm)

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