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25 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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VIEW |
2,479
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
3,036
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
1,064
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
1,337
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | |||
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VIEW |
1,011
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Phosphor Bronze | 200.0µin (5.08µm) | |||
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VIEW |
1,392
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Phosphor Bronze | 200.0µin (5.08µm) | |||
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|
VIEW |
1,012
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Phosphor Bronze | 10.0µin (0.25µm) | |||
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VIEW |
1,926
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Phosphor Bronze | 10.0µin (0.25µm) | |||
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VIEW |
3,760
In-stock
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CNC Tech | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 24 (2 x 12) | Phosphor Bronze | 60.0µin (1.52µm) | |||
|
VIEW |
2,717
In-stock
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3M | CONN IC DIP SOCKET 24POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 24 (2 x 12) | Phosphor Bronze | 35.0µin (0.90µm) | |||
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VIEW |
3,881
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
3,737
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
3,574
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
2,935
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
693
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Phosphor Bronze | - | |||
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VIEW |
924
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 24 (2 x 12) | Phosphor Bronze | 60.0µin (1.52µm) | |||
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VIEW |
1,558
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 24 (2 x 12) | Phosphor Bronze | 10.0µin (0.25µm) | |||
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VIEW |
2,880
In-stock
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Aries Electronics | CONN IC DIP SOCKET 24POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 24 (2 x 12) | Phosphor Bronze | 200.0µin (5.08µm) | |||
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VIEW |
3,558
In-stock
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CNC Tech | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 24 (2 x 12) | Phosphor Bronze | 100.0µin (2.54µm) | |||
|
VIEW |
2,856
In-stock
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On Shore Technology Inc. | CONN IC DIP SOCKET 24POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 24 (2 x 12) | Phosphor Bronze | 60.0µin (1.52µm) | |||
|
VIEW |
2,721
In-stock
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3M | CONN IC DIP SOCKET 24POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 24 (2 x 12) | Phosphor Bronze | 35.0µin (0.90µm) | |||
|
VIEW |
830
In-stock
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3M | CONN IC DIP SOCKET 24POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 24 (2 x 12) | Phosphor Bronze | 35.0µin (0.90µm) | |||
|
VIEW |
2,455
In-stock
|
3M | CONN IC DIP SOCKET 24POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 24 (2 x 12) | Phosphor Bronze | 35.0µin (0.90µm) | |||
|
VIEW |
2,757
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 24 (2 x 12) | Phosphor Bronze | - | |||
|
VIEW |
2,139
In-stock
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On Shore Technology Inc. | CONN IC DIP SOCKET 24POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 24 (2 x 12) | Phosphor Bronze | 60.0µin (1.52µm) | |||
