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31 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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VIEW |
1,396
In-stock
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Samtec Inc. | CONN ADAPTER PLUG 28POS GOLD | APA | Active | Bulk | - | Through Hole | Solder | Open Frame | - | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | 28 (2 x 14) | Phosphor Bronze | 20.0µin (0.51µm) | |||
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VIEW |
2,692
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
3,964
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
3,347
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
3,221
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | |||
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VIEW |
1,971
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | |||
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VIEW |
2,125
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | |||
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VIEW |
1,451
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | |||
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VIEW |
3,700
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | |||
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VIEW |
1,485
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | |||
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VIEW |
1,370
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | |||
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VIEW |
1,662
In-stock
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On Shore Technology Inc. | CONN SOCKET PLCC 28POS TIN | ED | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | PLCC | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | |||
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VIEW |
1,733
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | |||
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VIEW |
2,335
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | |||
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VIEW |
2,919
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | 28 (2 x 14) | Phosphor Bronze | 200.0µin (5.08µm) | |||
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VIEW |
1,572
In-stock
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3M | CONN IC DIP SOCKET 28POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 28 (2 x 14) | Phosphor Bronze | 35.0µin (0.90µm) | |||
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VIEW |
2,074
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | |||
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VIEW |
3,227
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | |||
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VIEW |
924
In-stock
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CNC Tech | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | |||
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VIEW |
2,028
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | |||
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|
VIEW |
2,964
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | |||
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|
VIEW |
1,637
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | |||
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|
VIEW |
3,126
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | |||
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|
VIEW |
1,113
In-stock
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Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 503 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | |||
|
VIEW |
3,626
In-stock
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3M | CONN IC DIP SOCKET 28POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 28 (2 x 14) | Phosphor Bronze | 35.0µin (0.90µm) | |||
|
VIEW |
1,013
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | |||
|
VIEW |
1,667
In-stock
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Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -55°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | 28 (2 x 14) | Phosphor Bronze | - | |||
|
VIEW |
2,794
In-stock
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CNC Tech | CONN IC DIP SOCKET 28POS TIN | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | 28 (2 x 14) | Phosphor Bronze | 100.0µin (2.54µm) | |||
|
VIEW |
2,348
In-stock
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On Shore Technology Inc. | CONN IC DIP SOCKET 28POS TIN | ED | Active | Tube | -55°C ~ 110°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | 28 (2 x 14) | Phosphor Bronze | 60.0µin (1.52µm) | |||
|
VIEW |
3,346
In-stock
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3M | CONN IC DIP SOCKET 28POS TIN | 4800 | Active | Tube | -25°C ~ 85°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 35.4µin (0.90µm) | 28 (2 x 14) | Phosphor Bronze | 35.0µin (0.90µm) | |||
