Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper - Brass
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3,779
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
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1,119
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 36 (2 x 18) Beryllium Copper 25.0µin (0.63µm) Copper
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2,307
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 28 (2 x 14) - - -
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3,483
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 32 (2 x 16) Beryllium Copper 196.9µin (5.00µm) Brass
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1,228
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS - Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) - - - 28 (2 x 14) Beryllium Copper - Copper
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3,078
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Copper
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868
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 32 (2 x 16) - - -
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1,584
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 32 (2 x 16) Copper Alloy - -
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3,199
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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2,366
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 36 (2 x 18) Beryllium Copper 20.0µin (0.51µm) Copper
832-AG11D
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2,025
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 32 (2 x 16) Copper Alloy - Copper Alloy
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2,566
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 28 (2 x 14) Beryllium Copper 25.0µin (0.63µm) Copper
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2,589
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 48POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 48 (2 x 24) Beryllium Copper 20.0µin (0.51µm) Copper
848-AG11D-ES
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RFQ
3,680
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 48POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 48 (2 x 24) Copper Alloy - Copper Alloy
6-1437536-3
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1,462
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper - Brass
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1,673
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Nickel
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3,135
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Nickel
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3,638
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 24 (2 x 12) Beryllium Copper - Brass
2-1571550-8
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RFQ
2,783
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 24 (2 x 12) Beryllium Copper 25.0µin (0.63µm) Beryllium Copper
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3,693
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 40 (2 x 20) Copper Alloy - -
1-1825109-3
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RFQ
3,551
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
2-641615-2
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RFQ
1,430
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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RFQ
1,489
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN - Active - -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 8 (2 x 4) Beryllium Copper 196.9µin (5.00µm) Brass
5-1571551-0
RFQ
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RFQ
3,681
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 32 (2 x 16) Beryllium Copper 25.0µin (0.63µm) Nickel
2-641267-4
RFQ
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RFQ
3,700
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 15.0µin (0.38µm) Gold 28 (2 x 14) Phosphor Bronze 15.0µin (0.38µm) Phosphor Bronze
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1,774
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 42POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) Gold 42 (2 x 21) Beryllium Copper 20.0µin (0.51µm) Copper
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3,399
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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3,021
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 28 (2 x 14) Copper Alloy - -
1-1437538-3
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RFQ
3,050
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TINLEAD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 28 (2 x 14) Copper Alloy - Copper Alloy