Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post
GLOBAL STOCKS
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3,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - 8 (2 x 4) Beryllium Copper Brass
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3,483
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) 32 (2 x 16) Beryllium Copper Brass
6-1437536-3
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1,462
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper Brass
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3,638
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) 24 (2 x 12) Beryllium Copper Brass
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1,489
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN - Active - -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) 8 (2 x 4) Beryllium Copper Brass
5-1437536-2
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2,024
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper Brass
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RFQ
1,881
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 24 (2 x 12) Beryllium Copper Brass
540-AG10D-ES
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RFQ
3,417
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 40 (2 x 20) Beryllium Copper Brass
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2,695
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 5.00µin (0.127µm) 24 (2 x 12) Beryllium Copper Brass
532-AG11D-ES
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RFQ
876
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper Brass
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RFQ
1,504
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube - Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 32 (2 x 16) Beryllium Copper Brass
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3,552
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) 28 (2 x 14) Beryllium Copper Brass
3-1437536-8
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RFQ
2,327
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 24 (2 x 12) Beryllium Copper Brass
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RFQ
796
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - 32 (2 x 16) Beryllium Copper Brass
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RFQ
666
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - 28 (2 x 14) Beryllium Copper Brass