Contact Finish - Mating :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
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2,829
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TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.025" (0.64mm) 200.0µin (5.08µm) Phosphor Bronze
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1,968
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TE Connectivity AMP Connectors CONN SOCKET LGA 1356LGA GOLD - Active - - - - - - - - - - - - - - - -
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2,586
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TE Connectivity AMP Connectors 514-21875-LF= ROHS R/A SOCKET - Active Tube - - - - - - - - - - - - - - -
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3,828
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 3POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 3 (1 x 3) Copper Alloy 0.100" (2.54mm) 80.0µin (2.03µm) Copper Alloy
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1,828
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TE Connectivity AMP Connectors CONN SOCKET PGA 370POS - Active Bulk - - - Open Frame PGA - - - - - 370 (19 x 19) - - - -
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1,294
In-stock
TE Connectivity AMP Connectors CONN ZIGZAG 370POS GOLD PKA Active Tube - Through Hole Solder Open Frame Zig-Zag Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 370 (19 x 19) Beryllium Copper 0.100" (2.54mm) - Brass
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2,263
In-stock
TE Connectivity AMP Connectors 512-22426=LED SOCKET ASSY - Active Bulk - - - - - - - - - - - - - - -
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3,396
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TE Connectivity AMP Connectors ADAPTER PLUG ASSY - Active Bulk - - - - - - - - - - - - - - -
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1,880
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TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS GOLD 8060 Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Polytetrafluoroethylene (PTFE) - Gold - Gold 3 (Oval) Beryllium Copper - - Beryllium Copper
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3,170
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 241POS GOLD PKA Active Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 241 (18 x 18) Copper Alloy 0.100" (2.54mm) 118.1µin (3.00µm) Phosphor Bronze
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815
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1567POS GOLD - Active Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 30.0µin (0.76µm) - 1567 Copper Alloy 0.039" (1.00mm) - Copper Alloy
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2,031
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) - Copper
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1,151
In-stock
TE Connectivity AMP Connectors STAMPED PIN - Active Bulk - - - - - - - - - - - - - - -
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725
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 370POS GOLD - Active Tray - - - - PGA - - Gold 30.0µin (0.76µm) Tin 370 (19 x 19) - - 67.0µin (1.70µm) -
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1,719
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper 0.043" (1.09mm) - -
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2,617
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper 0.043" (1.09mm) - -
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668
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD - Active Tube - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) - Brass
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3,111
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) - Brass
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1,181
In-stock
TE Connectivity AMP Connectors STAMPED PIN - Active Bulk - - - - - - - - - - - - - - -
2-822114-4
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871
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 160POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 160 (4 x 40) Phosphor Bronze 0.050" (1.27mm) 200.0µin (5.08µm) Phosphor Bronze
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1,429
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 241POS GOLD PKA Active Bulk - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 241 (18 x 18) Beryllium Copper 0.100" (2.54mm) 118.1µin (3.00µm) Phosphor Bronze
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1,937
In-stock
TE Connectivity AMP Connectors CONN SOCKET PGA 181POS GOLD - Active Tube - Through Hole Press-Fit Open Frame PGA Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 181 (15 x 15) Beryllium Copper 0.100" (2.54mm) 118.1µin (3.00µm) Phosphor Bronze
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2,141
In-stock
TE Connectivity AMP Connectors 512-22426-LF=LED SOCKET ASSY - Active Bulk - - - - - - - - - - - - - - -
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1,757
In-stock
TE Connectivity AMP Connectors STAMPED PIN - Active Bulk - - - - - - - - - - - - - - -
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3,278
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 2011POS GOLD - Active Tray - Surface Mount Solder Open Frame LGA Thermoplastic - Gold 30.0µin (0.76µm) Gold 2011 (47 x 58) Copper Alloy - 30.0µin (0.76µm) Copper Alloy
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2,818
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1366POS GOLD - Active Tray - Surface Mount Solder Open Frame LGA Thermoplastic 0.040" (1.02mm) Gold 30.0µin (0.76µm) - 1366 (32 x 41) Copper Alloy 0.040" (1.01mm) - -
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3,465
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TE Connectivity AMP Connectors CONN SOCKET PGA 321POS GOLD - Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame PGA Thermoplastic, Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 321 (19 x 19) Copper Alloy 0.100" (2.54mm) - Copper Alloy
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2,498
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TE Connectivity AMP Connectors CONN SOCKET LGA 1944POS GOLD - Active Tray - Surface Mount Solder Open Frame LGA Liquid Crystal Polymer (LCP) 0.039" (1.00mm) Gold 30.0µin (0.76µm) - 1944 (G34) Copper Alloy 0.039" (1.00mm) - -
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3,779
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy 0.100" (2.54mm) - Copper Alloy
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1,643
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TE Connectivity AMP Connectors STAMPED PIN - Active Bulk - - - - - - - - - - - - - - -