Contact Finish - Mating :
Contact Material - Mating :
Contact Finish Thickness - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,829
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TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.025" (0.64mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.025" (0.64mm) 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,880
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS GOLD 8060 Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Polytetrafluoroethylene (PTFE) - Gold - Gold 3 (Oval) Beryllium Copper - - Beryllium Copper
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RFQ
2,031
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 14POS TIN 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Tin - - 14 (2 x 7) Beryllium Copper 0.100" (2.54mm) - Copper
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RFQ
1,719
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper 0.043" (1.09mm) - -
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RFQ
2,617
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1207POS GOLD - Active Tray -55°C ~ 110°C Surface Mount Solder Closed Frame LGA Thermoplastic 0.043" (1.09mm) Gold - - 1207 (33 x 34) Beryllium Copper 0.043" (1.09mm) - -
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RFQ
668
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS GOLD - Active Tube - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 20 (2 x 10) Beryllium Copper 0.100" (2.54mm) - Brass
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RFQ
3,111
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper 0.100" (2.54mm) - Brass
2-822114-4
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RFQ
871
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 160POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 160 (4 x 40) Phosphor Bronze 0.050" (1.27mm) 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
3,779
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy 0.100" (2.54mm) - Copper Alloy
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RFQ
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RFQ
3,212
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 12POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Press-Fit Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) - Brass
8080-1G9
RFQ
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RFQ
3,769
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 4POS GOLD 8080 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-3 Fluoropolymer (FP) - Gold - Gold 4 (Round) Beryllium Copper - - Beryllium Copper
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RFQ
1,313
In-stock
TE Connectivity AMP Connectors CONN SOCKET LGA 1156POS GOLD - Active Tray - Surface Mount Solder Closed Frame LGA Thermoplastic 0.036" (0.91mm) Gold 15.0µin (0.38µm) - 1156 (34 x 34) Copper Alloy 0.039" (1.00mm) - Copper Alloy
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RFQ
1,397
In-stock
TE Connectivity AMP Connectors CONN SOCKET PQFP 132POS TIN-LEAD - Active Tube - Through Hole Solder Closed Frame QFP Liquid Crystal Polymer (LCP) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 132 (4 x 33) Phosphor Bronze 0.050" (1.27mm) 200.0µin (5.08µm) Phosphor Bronze
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RFQ
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RFQ
1,278
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS GOLD 8080 Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Polytetrafluoroethylene (PTFE) - Gold 30.0µin (0.76µm) Gold 3 (Oval) Beryllium Copper - 30.0µin (0.76µm) Beryllium Copper
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RFQ
2,566
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-5 8POS GOLD 8058 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polytetrafluoroethylene (PTFE) - Gold - Gold 8 (Round) Beryllium Copper - - Brass
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RFQ
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RFQ
2,017
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-3 3POS TIN 8080 Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Polytetrafluoroethylene (PTFE) - Tin 200.0µin (5.08µm) Tin 3 (Oval) Beryllium Copper - 200.0µin (5.08µm) Beryllium Copper
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RFQ
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2,307
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 28 (2 x 14) - 0.100" (2.54mm) - -
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RFQ
3,659
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-3 3POS - Active Bulk -55°C ~ 125°C Chassis Mount Solder Closed Frame Transistor, TO-3 Diallyl Phthalate (DAP) - Tin-Lead 20.0µin (0.51µm) Tin-Lead 3 (Round) Beryllium Copper - 20.0µin (0.51µm) Beryllium Copper
522-AG10D
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RFQ
1,227
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 22 (2 x 11) Copper Alloy 0.100" (2.54mm) - Copper Alloy
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RFQ
1,532
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-5 10POS GOLD 8058 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polytetrafluoroethylene (PTFE) - Gold - Gold 10 (Round) Beryllium Copper - - Brass
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RFQ
3,204
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 20.0µin (0.51µm) - 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) - Brass
8059-2G8
RFQ
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RFQ
2,830
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-5 8POS GOLD 8058 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polytetrafluoroethylene (PTFE) - Gold - Gold 8 (Round) Beryllium Copper - - Brass
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RFQ
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RFQ
1,588
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD Diplomate DL Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 30.0µin (0.76µm) Beryllium Copper
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RFQ
1,228
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS - Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) - - - 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) - Copper
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RFQ
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RFQ
1,471
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 20POS GOLD 500 Active Bulk - Through Hole Solder Closed Frame SIP - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 20 (1 x 20) Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper
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RFQ
3,418
In-stock
TE Connectivity AMP Connectors CONN TRANSIST TO-5 8POS GOLD 8058 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polytetrafluoroethylene (PTFE) - Gold - Gold 8 (Round) Beryllium Copper - - Brass
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RFQ
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RFQ
2,076
In-stock
TE Connectivity AMP Connectors CONN SOCKET TRANSIST TO-5 8POS - Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Transistor, TO-5 Polyamide (PA), Nylon, Glass Filled - Gold - Gold 8 (Round) Beryllium Copper - - Brass
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RFQ
868
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 32 (2 x 16) - 0.100" (2.54mm) - -
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RFQ
737
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 22POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Gold 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) 25.0µin (0.63µm) Nickel
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RFQ
3,199
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy 0.100" (2.54mm) - Copper Alloy