- Termination :
- Housing Material :
-
- Diallyl Phthalate (DAP) (3)
- Fluoropolymer (FP) (6)
- Phenolic (1)
- Polyamide (PA), Nylon (1)
- Polyamide (PA), Nylon, Glass Filled (2)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (29)
- Polyester (18)
- Polytetrafluoroethylene (PTFE) (29)
- Thermoplastic (2)
- Thermoplastic, Glass Filled (9)
- Thermoplastic, Polyester (7)
- Contact Finish - Mating :
- Number of Positions or Pins (Grid) :
-
- 10 (1 x 10) (2)
- 10 (2 x 5) (1)
- 10 (Round) (2)
- 14 (1 x 14) (1)
- 14 (2 x 7) (9)
- 16 (1 x 16) (1)
- 16 (2 x 8) (11)
- 18 (2 x 9) (4)
- 20 (1 x 20) (3)
- 20 (2 x 10) (7)
- 22 (2 x 11) (4)
- 24 (2 x 12) (5)
- 28 (2 x 14) (12)
- 3 (Oval) (12)
- 3 (Round) (10)
- 32 (2 x 16) (8)
- 36 (2 x 18) (2)
- 4 (Round) (8)
- 40 (2 x 20) (7)
- 5 (1 x 5) (1)
- 6 (2 x 3) (4)
- 8 (2 x 4) (7)
- 8 (Round) (10)
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
131 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,880
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-3 3POS GOLD | 8060 | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Polytetrafluoroethylene (PTFE) | - | Gold | - | Gold | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,031
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS TIN | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | - | 14 (2 x 7) | Beryllium Copper | - | Copper | |||
|
VIEW |
3,779
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
3,769
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-3 4POS GOLD | 8080 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Fluoropolymer (FP) | - | Gold | - | Gold | 4 (Round) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,278
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-3 3POS GOLD | 8080 | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Polytetrafluoroethylene (PTFE) | - | Gold | 30.0µin (0.76µm) | Gold | 3 (Oval) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
2,566
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-5 8POS GOLD | 8058 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polytetrafluoroethylene (PTFE) | - | Gold | - | Gold | 8 (Round) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,017
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-3 3POS TIN | 8080 | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Polytetrafluoroethylene (PTFE) | - | Tin | 200.0µin (5.08µm) | Tin | 3 (Oval) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,659
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Chassis Mount | Solder | Closed Frame | Transistor, TO-3 | Diallyl Phthalate (DAP) | - | Tin-Lead | 20.0µin (0.51µm) | Tin-Lead | 3 (Round) | Beryllium Copper | 20.0µin (0.51µm) | Beryllium Copper | |||
|
VIEW |
1,227
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 22 (2 x 11) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
1,532
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-5 10POS GOLD | 8058 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polytetrafluoroethylene (PTFE) | - | Gold | - | Gold | 10 (Round) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,204
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | - | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,830
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-5 8POS GOLD | 8058 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polytetrafluoroethylene (PTFE) | - | Gold | - | Gold | 8 (Round) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,588
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,418
In-stock
|
TE Connectivity AMP Connectors | CONN TRANSIST TO-5 8POS GOLD | 8058 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polytetrafluoroethylene (PTFE) | - | Gold | - | Gold | 8 (Round) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,076
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-5 8POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-5 | Polyamide (PA), Nylon, Glass Filled | - | Gold | - | Gold | 8 (Round) | Beryllium Copper | - | Brass | |||
|
VIEW |
737
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 22POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.4" (10.16mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 22 (2 x 11) | Beryllium Copper | 25.0µin (0.63µm) | Nickel | |||
|
VIEW |
3,199
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 500 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
760
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 20 (2 x 10) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
|
VIEW |
1,462
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 32 (2 x 16) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,176
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 20POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 20 (1 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | |||
|
VIEW |
3,638
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 24 (2 x 12) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,783
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 24 (2 x 12) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | |||
|
VIEW |
835
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET TRANSIST TO-3 3POS | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | Transistor, TO-3 | Phenolic | - | Tin-Lead | 200.0µin (5.08µm) | Tin-Lead | 3 (Oval) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
1,049
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 10POS GOLD | - | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,681
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 32 (2 x 16) | Beryllium Copper | 25.0µin (0.63µm) | Nickel | |||
|
VIEW |
946
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 14 (2 x 7) | Beryllium Copper | 25.0µin (0.63µm) | Copper Alloy | |||
|
VIEW |
3,718
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 14 (2 x 7) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
3,700
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,269
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 16POS GOLD | - | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | Flash | Tin | 16 (1 x 16) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
VIEW |
2,428
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 14 (2 x 7) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper |