Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,111
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS GOLD - Active Bulk - Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold - Tin 8 (2 x 4) Beryllium Copper - Brass
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3,779
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 8POS TIN-LEAD 500 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Tin-Lead - Tin-Lead 8 (2 x 4) Copper Alloy - Copper Alloy
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2,307
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 28 (2 x 14) - - -
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1,228
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS - Active Bulk - Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) - - - 28 (2 x 14) Beryllium Copper - Copper
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3,078
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Copper
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868
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS 500 Active - - Through Hole - Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) - - - 32 (2 x 16) - - -
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1,584
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 32 (2 x 16) Copper Alloy - -
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3,199
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
832-AG11D
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2,025
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 32 (2 x 16) Copper Alloy - Copper Alloy
848-AG11D-ES
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RFQ
3,680
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 48POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 48 (2 x 24) Copper Alloy - Copper Alloy
6-1437536-3
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RFQ
1,462
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 32 (2 x 16) Beryllium Copper - Brass
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1,673
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Beryllium Copper - Nickel
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3,135
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 32POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 32 (2 x 16) Beryllium Copper - Nickel
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3,638
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 24 (2 x 12) Beryllium Copper - Brass
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3,693
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 5.00µin (0.127µm) - 40 (2 x 20) Copper Alloy - -
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3,399
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold - Gold 28 (2 x 14) Copper Alloy - Copper Alloy
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RFQ
3,021
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 28 (2 x 14) Copper Alloy - -
1-1437538-3
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RFQ
3,050
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TINLEAD 800 Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 28 (2 x 14) Copper Alloy - Copper Alloy
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634
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TINLEAD 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 40 (2 x 20) Beryllium Copper - Beryllium Copper
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3,271
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 40 (2 x 20) Beryllium Copper - Beryllium Copper
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RFQ
1,370
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
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2,196
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Phosphor Bronze - Phosphor Bronze
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775
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper - Beryllium Copper
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RFQ
1,733
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 28 (2 x 14) Phosphor Bronze - Phosphor Bronze
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1,710
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Phosphor Bronze - Phosphor Bronze
5-1437536-2
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RFQ
2,024
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 28POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 28 (2 x 14) Beryllium Copper - Brass
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RFQ
3,477
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TIN 500 Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin - Tin 24 (2 x 12) Beryllium Copper - Beryllium Copper
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2,143
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS TINLEAD 500 Active Bulk -55°C ~ 105°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyester 0.100" (2.54mm) Tin-Lead - Tin-Lead 24 (2 x 12) Beryllium Copper - Brass, Copper
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RFQ
1,881
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Active Bulk - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - Tin 24 (2 x 12) Beryllium Copper - Brass
540-AG10D-ES
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RFQ
3,417
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 40POS GOLD 500 Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold - - 40 (2 x 20) Beryllium Copper - Brass