- Series :
- Operating Temperature :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
- Number of Positions or Pins (Grid) :
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
115 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | ||||||||||||||||||||||||
VIEW |
3,779
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
1,119
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 36POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 36 (2 x 18) | Beryllium Copper | 25.0µin (0.63µm) | Copper | ||||
VIEW |
3,078
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | - | Copper | ||||
VIEW |
1,584
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 32 (2 x 16) | Copper Alloy | - | - | ||||
VIEW |
2,366
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 36POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 36 (2 x 18) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
2,025
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 32 (2 x 16) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
2,566
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 28 (2 x 14) | Beryllium Copper | 25.0µin (0.63µm) | Copper | ||||
VIEW |
2,589
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 48POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 48 (2 x 24) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
3,680
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 48POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Tin-Lead | 48 (2 x 24) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
1,462
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | - | 32 (2 x 16) | Beryllium Copper | - | Brass | ||||
VIEW |
1,673
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | - | Nickel | ||||
VIEW |
3,135
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | - | Nickel | ||||
VIEW |
3,638
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 24 (2 x 12) | Beryllium Copper | - | Brass | ||||
VIEW |
2,783
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 24 (2 x 12) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | ||||
VIEW |
3,693
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | - | 40 (2 x 20) | Copper Alloy | - | - | ||||
VIEW |
3,551
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 40 (2 x 20) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
1,430
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 30.0µin (0.76µm) | Beryllium Copper | ||||
VIEW |
3,681
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 32 (2 x 16) | Beryllium Copper | 25.0µin (0.63µm) | Nickel | ||||
VIEW |
3,700
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | ||||
VIEW |
1,774
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 42POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Gold | 42 (2 x 21) | Beryllium Copper | 20.0µin (0.51µm) | Copper | ||||
VIEW |
3,021
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | - | 28 (2 x 14) | Copper Alloy | - | - | ||||
VIEW |
3,050
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TINLEAD | 800 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 28 (2 x 14) | Copper Alloy | - | Copper Alloy | ||||
VIEW |
866
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | 500 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Gold | 40 (2 x 20) | Beryllium Copper | 25.0µin (0.63µm) | Beryllium Copper | ||||
VIEW |
634
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TINLEAD | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
3,271
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS TIN | 500 | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
1,370
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
2,196
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
775
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Beryllium Copper | - | Beryllium Copper | ||||
VIEW |
1,733
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Phosphor Bronze | - | Phosphor Bronze | ||||
VIEW |
1,710
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Phosphor Bronze | - | Phosphor Bronze |