Contact Finish - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,340
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Harwin Inc. CONN SOCKET SIP 46POS GOLD D01-950 Obsolete Tube -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 46 (1 x 46) Beryllium Copper - Brass
5-1437530-2
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1,933
In-stock
TE Connectivity AMP Connectors CONN IC SIP SOCKET 8POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder - SIP Polyester 0.100" (2.54mm) Gold - Tin-Lead 8 (1 x 8) Beryllium Copper - Brass
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2,029
In-stock
Harwin Inc. CONN IC DIP SOCKET 64POS GOLD D73064 Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, Staggered Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.050" (1.27mm) Gold - Tin 64 (2 x 32) Beryllium Copper 196.9µin (5.00µm) Brass
SA649040
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3,109
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 64POS GOLD SA Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Gold 64 (2 x 32) Beryllium Copper 80.0µin (2.03µm) Brass
SA649000
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3,056
In-stock
On Shore Technology Inc. CONN IC DIP SOCKET 64POS GOLD SA Obsolete Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass
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1,478
In-stock
Amphenol FCI CONN IC DIP SOCKET 8POS TIN-LEAD DPF3 Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass
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1,077
In-stock
Amphenol FCI CONN IC DIP SOCKET 14POS TINLEAD DPF3 Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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1,569
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS TINLEAD DPF3 Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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1,897
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,294
In-stock
TE Connectivity AMP Connectors CONN ZIGZAG 370POS GOLD PKA Active Tube - Through Hole Solder Open Frame Zig-Zag Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 370 (19 x 19) Beryllium Copper - Brass
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3,492
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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2,929
In-stock
Amphenol FCI CONN IC DIP SOCKET 6POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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1,449
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,442
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,101
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,513
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,417
In-stock
Amphenol FCI CONN IC DIP SOCKET 14POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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1,249
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,075
In-stock
Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,772
In-stock
Amphenol FCI CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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3,228
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,130
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,010
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS TIN - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,242
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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2,069
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,382
In-stock
Amphenol FCI CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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915
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,500
In-stock
Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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3,703
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 36POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing - 0.100" (2.54mm) Gold 25.0µin (0.63µm) - 36 (2 x 18) Beryllium Copper - Brass
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2,131
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 6POS GOLD 500 Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Gold - Gold 6 (2 x 3) Beryllium Copper - Brass