Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,772
In-stock
Amphenol FCI CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,656
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 18POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 29.5µin (0.75µm) Gold 18 (2 x 9) Beryllium Copper 29.5µin (0.75µm) Brass
299-87-618-10-002101
RFQ
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RFQ
859
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
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RFQ
2,731
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
116-83-318-41-004101
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RFQ
1,331
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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2,315
In-stock
CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -55°C ~ 105°C Through Hole Wire Wrap Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
116-87-318-41-009101
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3,319
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
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1,790
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
116-83-318-41-003101
RFQ
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RFQ
3,821
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
116-87-318-41-008101
RFQ
VIEW
RFQ
2,331
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
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2,137
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
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RFQ
2,440
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
116-87-318-41-002101
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RFQ
2,738
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
116-83-318-41-018101
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RFQ
1,229
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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891
In-stock
Samtec Inc. CONN IC DIP SOCKET 18POS TIN ICA Active Tube -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Tin - Tin 18 (2 x 9) Beryllium Copper - Brass
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2,302
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D95 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
116-87-318-41-007101
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RFQ
2,284
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
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RFQ
2,721
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame, No Center Bar DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
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3,530
In-stock
CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
299-83-618-10-002101
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RFQ
3,592
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
D2818-42
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RFQ
1,589
In-stock
Harwin Inc. CONN IC DIP SOCKET 18POS GOLD D2 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Plastic 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
210-1-18-003
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RFQ
3,531
In-stock
CNC Tech CONN IC DIP SOCKET 18POS GOLD - Active Tube -40°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 18 (2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
299-87-318-11-001101
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VIEW
RFQ
3,755
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
299-87-318-10-001101
RFQ
VIEW
RFQ
2,353
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass
299-83-318-10-001101
RFQ
VIEW
RFQ
2,826
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 299 Active Tube -55°C ~ 125°C Through Hole, Right Angle, Horizontal Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
116-83-318-41-002101
RFQ
VIEW
RFQ
2,231
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
116-83-318-41-009101
RFQ
VIEW
RFQ
2,599
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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RFQ
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RFQ
2,532
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
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RFQ
746
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 146 Active Tube -55°C ~ 125°C Through Hole Press-Fit Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (2 x 9) Beryllium Copper - Brass
116-87-318-41-011101
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RFQ
3,450
In-stock
Preci-Dip CONN IC DIP SOCKET 18POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (2 x 9) Beryllium Copper - Brass