Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,340
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Harwin Inc. CONN SOCKET SIP 46POS GOLD D01-950 Obsolete Tube -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 46 (1 x 46) Beryllium Copper - Brass
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1,294
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TE Connectivity AMP Connectors CONN ZIGZAG 370POS GOLD PKA Active Tube - Through Hole Solder Open Frame Zig-Zag Thermoplastic, Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 370 (19 x 19) Beryllium Copper - Brass
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3,492
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Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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2,929
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Amphenol FCI CONN IC DIP SOCKET 6POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 6 (2 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,101
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Amphenol FCI CONN IC DIP SOCKET 16POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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3,513
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 24 (2 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,417
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Amphenol FCI CONN IC DIP SOCKET 14POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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1,242
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Amphenol FCI CONN IC DIP SOCKET 40POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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2,069
In-stock
Amphenol FCI CONN IC DIP SOCKET 28POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,382
In-stock
Amphenol FCI CONN IC DIP SOCKET 32POS GOLD - Obsolete Tube - Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass
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2,750
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 24POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 24 (2 x 12) Beryllium Copper - Brass
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3,950
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 4POS GOLD - Obsolete Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 4 (2 x 2) Beryllium Copper 30.0µin (0.76µm) Brass
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1,049
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 10POS GOLD - Active Tube -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) - 10 (2 x 5) Beryllium Copper - Brass
ICA-628-SGT
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3,581
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Samtec Inc. CONN IC DIP SOCKET 28POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper - Brass
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1,750
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Samtec Inc. CONN IC DIP SOCKET 20POS GOLD ICA Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 20 (2 x 10) Beryllium Copper - Brass
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2,546
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Samtec Inc. CONN IC DIP SOCKET 16POS GOLD ICO Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 16 (2 x 8) Beryllium Copper - Brass
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2,251
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TE Connectivity AMP Connectors CONN SOCKET SIP 10POS GOLD - Active Tube - Through Hole Solder Closed Frame SIP Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 10 (1 x 10) Beryllium Copper 30.0µin (0.76µm) Brass