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17 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
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VIEW |
3,340
In-stock
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Harwin Inc. | CONN SOCKET SIP 46POS GOLD | D01-950 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 46 (1 x 46) | Beryllium Copper | - | Brass | |||
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VIEW |
1,294
In-stock
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TE Connectivity AMP Connectors | CONN ZIGZAG 370POS GOLD | PKA | Active | Tube | - | Through Hole | Solder | Open Frame | Zig-Zag | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 370 (19 x 19) | Beryllium Copper | - | Brass | |||
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VIEW |
3,492
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,929
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 6POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 6 (2 x 3) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,101
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 16POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,513
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,417
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 14POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,242
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,069
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
1,382
In-stock
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Amphenol FCI | CONN IC DIP SOCKET 32POS GOLD | - | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,750
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 24 (2 x 12) | Beryllium Copper | - | Brass | |||
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VIEW |
3,950
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 4POS GOLD | - | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 4 (2 x 2) | Beryllium Copper | 30.0µin (0.76µm) | Brass | |||
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VIEW |
1,049
In-stock
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TE Connectivity AMP Connectors | CONN IC DIP SOCKET 10POS GOLD | - | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | - | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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VIEW |
3,581
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | ICA | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | - | Brass | |||
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VIEW |
1,750
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 20POS GOLD | ICA | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 20 (2 x 10) | Beryllium Copper | - | Brass | |||
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VIEW |
2,546
In-stock
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Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | ICO | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 16 (2 x 8) | Beryllium Copper | - | Brass | |||
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VIEW |
2,251
In-stock
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TE Connectivity AMP Connectors | CONN SOCKET SIP 10POS GOLD | - | Active | Tube | - | Through Hole | Solder | Closed Frame | SIP | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (1 x 10) | Beryllium Copper | 30.0µin (0.76µm) | Brass |