Contact Finish - Mating :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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645
In-stock
Amphenol FCI CONN SOCKET SIP 2POS TIN - Obsolete Tape & Reel (TR) - Surface Mount Solder Closed Frame SIP Polyamide (PA), Nylon 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
940-99-032-17-400000
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3,767
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 32POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 32 (2 x 7, 2 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-028-17-400000
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1,775
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 28POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 28 (4 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-020-17-400000
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1,975
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 20POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 20 (4 x 5) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-084-17-400000
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RFQ
1,695
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 84POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 84 (4 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-068-17-400000
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2,159
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 68POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 68 (4 x 17) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,015
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 52POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 52 (4 x 13) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
940-99-044-17-400000
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RFQ
1,394
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET PLCC 44POS TIN-LEAD 940 Obsolete Tube -55°C ~ 125°C Surface Mount Solder Closed Frame PLCC Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 44 (4 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,097
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,102
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-964-41-105000
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RFQ
1,575
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 64 (2 x 32) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,937
In-stock
TE Connectivity AMP Connectors CONN IC DIP SOCKET 20POS TIN - Obsolete Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass
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3,221
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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894
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
110-93-640-41-105000
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RFQ
1,578
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-952-41-105000
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RFQ
3,233
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-652-41-105000
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VIEW
RFQ
875
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 52 (2 x 26) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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632
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 36 (2 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-632-41-105000
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RFQ
3,075
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-432-41-105000
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RFQ
2,112
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 32 (2 x 16) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
888
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
3,586
In-stock
Aries Electronics CONN IC DIP SOCKET 40POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (2 x 20) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,257
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,858
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
1,662
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,974
In-stock
Aries Electronics CONN SOCKET SIP 2POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 2 (1 x 2) Beryllium Copper 200.0µin (5.08µm) Brass
110-93-422-41-105000
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RFQ
857
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 22 (2 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-420-41-105000
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RFQ
3,577
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.4" (10.16mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-320-41-105000
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RFQ
2,088
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 20POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 20 (2 x 10) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-308-41-105000
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RFQ
1,414
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 8POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 8 (2 x 4) Beryllium Copper 200.0µin (5.08µm) Brass Alloy