Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,368
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,681
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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648
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CNC Tech CONN IC DIP SOCKET 14POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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720
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
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3,214
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Aries Electronics CONN IC DIP SOCKET 14POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass
214-99-314-01-670800
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2,215
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-44-314-01-670800
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1,273
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,570
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-314-41-105000
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1,191
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-47-314-41-001000
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2,513
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 210 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 14 (2 x 7) Beryllium Copper 200.0µin (5.08µm) Brass Alloy