Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
110-93-316-41-105000
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1,370
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,752
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,130
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 16POS TIN - Active Tape & Reel (TR) -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Thermoplastic, Polyester 0.100" (2.54mm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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736
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CNC Tech CONN IC DIP SOCKET 16POS GOLD - Active Tube -40°C ~ 105°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polybutylene Terephthalate (PBT) 0.100" (2.54mm) Gold - 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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2,359
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
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669
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Aries Electronics CONN IC DIP SOCKET 16POS GOLD EJECT-A-DIP™ Active Bulk -55°C ~ 105°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass
214-99-316-01-670800
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2,748
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS TINLEAD 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-47-316-41-105000
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3,807
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 110 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
210-47-316-41-001000
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3,317
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 210 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
214-44-316-01-670800
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840
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS TIN 214 Active Tube -55°C ~ 125°C Surface Mount Solder Closed Frame DIP, 0.3" (7.62mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Tin 100.0µin (2.54µm) 16 (2 x 8) Beryllium Copper 200.0µin (5.08µm) Brass Alloy