Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,753
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Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 361 (18 x 18) Beryllium Copper - Brass
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3,094
In-stock
Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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2,773
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 281 (19 x 19) Beryllium Copper - Brass
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3,631
In-stock
Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 281 (19 x 19) Beryllium Copper - Brass
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3,782
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 279 (19 x 19) Beryllium Copper - Brass
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3,999
In-stock
Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 279 (19 x 19) Beryllium Copper - Brass
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RFQ
773
In-stock
Preci-Dip CONN SOCKET BGA 652POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 652 (35 x 35) Beryllium Copper - Brass
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1,451
In-stock
Preci-Dip CONN SOCKET BGA 600POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 600 (35 x 35) Beryllium Copper - Brass
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RFQ
2,274
In-stock
Preci-Dip CONN SOCKET BGA 576POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 576 (30 x 30) Beryllium Copper - Brass
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3,210
In-stock
Preci-Dip CONN SOCKET BGA 560POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 560 (33 x 33) Beryllium Copper - Brass
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VIEW
RFQ
1,481
In-stock
Preci-Dip CONN SOCKET BGA 652POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 652 (35 x 35) Beryllium Copper - Brass
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1,420
In-stock
Preci-Dip CONN SOCKET BGA 520POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 520 (31 x 31) Beryllium Copper - Brass
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VIEW
RFQ
1,686
In-stock
Preci-Dip CONN SOCKET BGA 504POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 504 (29 x 29) Beryllium Copper - Brass
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2,727
In-stock
Preci-Dip CONN SOCKET BGA 500POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 500 (30 x 30) Beryllium Copper - Brass
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1,766
In-stock
Preci-Dip CONN SOCKET BGA 600POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 600 (35 x 35) Beryllium Copper - Brass
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VIEW
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3,533
In-stock
Preci-Dip CONN SOCKET BGA 480POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 480 (29 x 29) Beryllium Copper - Brass
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649
In-stock
Preci-Dip CONN SOCKET BGA 478POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 478 (26 x 26) Beryllium Copper - Brass
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2,416
In-stock
Preci-Dip CONN SOCKET BGA 576POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 576 (30 x 30) Beryllium Copper - Brass
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2,515
In-stock
Preci-Dip CONN SOCKET BGA 456POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 456 (26 x 26) Beryllium Copper - Brass
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2,323
In-stock
Preci-Dip CONN SOCKET BGA 560POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 560 (33 x 33) Beryllium Copper - Brass
Default Photo
RFQ
VIEW
RFQ
2,017
In-stock
Preci-Dip CONN SOCKET PGA 296POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 296 (19 x 19) Beryllium Copper - Brass
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2,531
In-stock
Preci-Dip CONN SOCKET BGA 272POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 272 (20 x 20) Beryllium Copper - Brass
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RFQ
3,874
In-stock
Aries Electronics CONN SOCKET PGA TIN PGM Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,478
In-stock
Aries Electronics CONN SOCKET PGA GOLD PG Active Bulk -55°C ~ 105°C Through Hole Solder - PGA Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin - Beryllium Copper 200.0µin (5.08µm) Brass
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2,676
In-stock
Preci-Dip CONN SOCKET BGA 256POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 256 (20 x 20) Beryllium Copper - Brass
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RFQ
1,443
In-stock
Preci-Dip CONN SOCKET BGA 256POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 256 (16 x 16) Beryllium Copper - Brass
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RFQ
737
In-stock
Preci-Dip CONN SOCKET BGA 255POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash Tin 255 (16 x 16) Beryllium Copper - Brass
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RFQ
1,964
In-stock
Aries Electronics CONN IC DIP SOCKET 48POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,742
In-stock
Preci-Dip CONN SOCKET PGA 529POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 529 (21 x 21) Beryllium Copper - Brass
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1,156
In-stock
Preci-Dip CONN SOCKET PGA 528POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) Tin 528 (21 x 21) Beryllium Copper - Brass