Contact Finish - Mating :
Number of Positions or Pins (Grid) :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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2,753
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Preci-Dip CONN SOCKET PGA 361POS GOLD 517 Active Bulk -55°C ~ 125°C Through Hole Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.050" (1.27mm) Gold 29.5µin (0.75µm) 361 (18 x 18) Beryllium Copper - Brass
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3,094
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Aries Electronics CONN IC DIP SOCKET 28POS GOLD 6556 Active Bulk - Through Hole Solder Cup Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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2,773
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Preci-Dip CONN SOCKET PGA 281POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 281 (19 x 19) Beryllium Copper - Brass
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3,631
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Preci-Dip CONN SOCKET PGA 281POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 281 (19 x 19) Beryllium Copper - Brass
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3,782
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Preci-Dip CONN SOCKET PGA 279POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 279 (19 x 19) Beryllium Copper - Brass
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2,828
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Aries Electronics CONN IC DIP SOCKET ZIF 28POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,999
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Preci-Dip CONN SOCKET PGA 279POS GOLD 614 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Open Frame PGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 279 (19 x 19) Beryllium Copper - Brass
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RFQ
773
In-stock
Preci-Dip CONN SOCKET BGA 652POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 652 (35 x 35) Beryllium Copper - Brass
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1,451
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Preci-Dip CONN SOCKET BGA 600POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 600 (35 x 35) Beryllium Copper - Brass
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2,274
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Preci-Dip CONN SOCKET BGA 576POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 576 (30 x 30) Beryllium Copper - Brass
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3,210
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Preci-Dip CONN SOCKET BGA 560POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 560 (33 x 33) Beryllium Copper - Brass
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3,784
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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3,639
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Aries Electronics CONN IC DIP SOCKET ZIF 48POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 48 (2 x 24) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,481
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Preci-Dip CONN SOCKET BGA 652POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 652 (35 x 35) Beryllium Copper - Brass
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1,420
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Preci-Dip CONN SOCKET BGA 520POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 520 (31 x 31) Beryllium Copper - Brass
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1,686
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Preci-Dip CONN SOCKET BGA 504POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 504 (29 x 29) Beryllium Copper - Brass
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2,727
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Preci-Dip CONN SOCKET BGA 500POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 500 (30 x 30) Beryllium Copper - Brass
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1,002
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,595
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
2,010
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,398
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Aries Electronics CONN IC DIP SOCKET ZIF 44POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,766
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Preci-Dip CONN SOCKET BGA 600POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 600 (35 x 35) Beryllium Copper - Brass
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3,533
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Preci-Dip CONN SOCKET BGA 480POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 480 (29 x 29) Beryllium Copper - Brass
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649
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Preci-Dip CONN SOCKET BGA 478POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 478 (26 x 26) Beryllium Copper - Brass
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3,180
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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RFQ
2,355
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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1,594
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Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,608
In-stock
Aries Electronics CONN IC DIP SOCKET ZIF 42POS TIN 57 Active Bulk - Through Hole Solder Closed Frame DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) 42 (2 x 21) Beryllium Copper 200.0µin (5.08µm) Beryllium Copper
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2,416
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Preci-Dip CONN SOCKET BGA 576POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold Flash 576 (30 x 30) Beryllium Copper - Brass
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2,515
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Preci-Dip CONN SOCKET BGA 456POS GOLD 514 Active Bulk -55°C ~ 125°C Surface Mount Solder Open Frame BGA Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) 456 (26 x 26) Beryllium Copper - Brass