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180 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
616
In-stock
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,997
In-stock
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,455
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,580
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,953
In-stock
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,578
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
3,343
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.9" (22.86mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,061
In-stock
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Aries Electronics | CONN IC DIP SOCKET 10POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,171
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,990
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
761
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
3,468
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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VIEW |
2,858
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,405
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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VIEW |
3,405
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,166
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
1,847
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,294
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 110 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,934
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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VIEW |
3,784
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
699
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,966
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 614 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
2,114
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
911
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,978
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,418
In-stock
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Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,007
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
|
VIEW |
2,613
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 116 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Elevated, Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
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|
VIEW |
1,188
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 10POS GOLD | - | Active | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 10 (2 x 5) | Beryllium Copper | Flash | Brass | |||
|
VIEW |
3,554
In-stock
|
Preci-Dip | CONN IC DIP SOCKET 10POS GOLD | 115 | Active | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 10 (2 x 5) | Beryllium Copper | - | Brass | |||
