Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Diameter Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
273-AB
RFQ
VIEW
RFQ
1,264
In-stock
Wakefield-Vette HEATSINK TO-220 LOW HEIGHT BLK 273 Active Aluminum Board Level Rectangular, Fins 0.750" (19.05mm) - TO-220, TO-218 Bolt On 0.375" (9.52mm) 2.0W @ 49°C 7.20°C/W @ 400 LFM 24.50°C/W Black Anodized
BDN11-3CB/A01
RFQ
VIEW
RFQ
2,579
In-stock
CTS Thermal Management Products HEATSINK CPU W/ADHESIVE 1.11"SQ BDN Active Aluminum Top Mount Square, Pin Fins 1.110" (28.19mm) - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) 0.355" (9.02mm) - 7.20°C/W @ 400 LFM 20.90°C/W Black Anodized