- Manufacture :
- Type :
- Length :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Thermal Resistance @ Natural :
2 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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GLOBAL STOCKS | |||||||||||||||||||||
VIEW |
1,264
In-stock
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Wakefield-Vette | HEATSINK TO-220 LOW HEIGHT BLK | 273 | Active | Aluminum | Board Level | Rectangular, Fins | 0.750" (19.05mm) | - | TO-220, TO-218 | Bolt On | 0.375" (9.52mm) | 2.0W @ 49°C | 7.20°C/W @ 400 LFM | 24.50°C/W | Black Anodized | ||||
VIEW |
2,579
In-stock
|
CTS Thermal Management Products | HEATSINK CPU W/ADHESIVE 1.11"SQ | BDN | Active | Aluminum | Top Mount | Square, Pin Fins | 1.110" (28.19mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized |