Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Material Type Shape Length Width Package Cooled Attachment Method Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
GLOBAL STOCKS
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RFQ
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RFQ
2,446
In-stock
Comair Rotron HEATSINK STAMP 25.9X15X9.5MM - Obsolete Copper Board Level Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak) SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
575002D00000G
RFQ
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RFQ
1,310
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active - Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 5.00°C/W @ 400 LFM 13.60°C/W Tin
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RFQ
VIEW
RFQ
2,298
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .375" D2PAK - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin
Default Photo
RFQ
VIEW
RFQ
3,466
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEAT SINK - Active Copper Board Level, Vertical Rectangular, Fins 1.180" (29.97mm) 1.000" (25.40mm) TO-220 Bolt On and PC Pin 0.500" (12.70mm) 1.0W @ 20°C 5.00°C/W @ 400 LFM 13.00°C/W Tin
7106DG
RFQ
VIEW
RFQ
3,886
In-stock
Aavid, Thermal Division of Boyd Corporation BOARD LEVEL HEATSINK .375" D2PAK - Active Copper Top Mount Rectangular, Fins 0.590" (15.00mm) 1.020" (25.91mm) TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 SMD Pad 0.375" (9.52mm) 2.0W @ 40°C 5.00°C/W @ 400 LFM - Tin