- Part Status :
- Material :
- Length :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Natural :
- Material Finish :
8 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
|
VIEW |
2,916
In-stock
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | - | Black Anodized | |||
|
VIEW |
766
In-stock
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 0.997" (25.33mm) | TO-220 | Clip and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | - | Black Anodized | |||
|
|
VIEW |
2,446
In-stock
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
|
VIEW |
1,310
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.60°C/W | Tin | |||
|
|
VIEW |
2,298
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
|
|
VIEW |
3,466
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.00°C/W | Tin | |||
|
VIEW |
829
In-stock
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TABS BLACK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.60°C/W | Black Anodized | |||
|
VIEW |
3,886
In-stock
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
