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Picture	Mfr Part #	QUANTITY		Inventory	MANUFACTURE	Description	Package	Series	Part Status	Material	Type	Shape	Length	Width	Package Cooled	Attachment Method	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material Finish
GLOBAL STOCKS
	ATS-PCB1074	RFQ VIEW	PDF RFQ	1,586 In-stock	Advanced Thermal Solutions Inc.	HEATSINK TO-263 COPPER		-	Active	Copper	Top Mount	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	TO-263 (D²Pak)	-	0.401" (10.20mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Tin
	ATS-PCB1074	RFQ VIEW	PDF RFQ	1,825 In-stock	Advanced Thermal Solutions Inc.	HEATSINK TO-263 COPPER		-	Active	Copper	Top Mount	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	TO-263 (D²Pak)	-	0.401" (10.20mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Tin
	ATS-PCB1074	RFQ VIEW	PDF RFQ	3,384 In-stock	Advanced Thermal Solutions Inc.	HEATSINK TO-263 COPPER		-	Active	Copper	Top Mount	Rectangular, Fins	0.500" (12.70mm)	1.031" (26.20mm)	TO-263 (D²Pak)	-	0.401" (10.20mm)	-	9.50°C/W @ 200 LFM	18.00°C/W	Tin
	573400D00010G	RFQ VIEW	PDF RFQ	1,222 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK D-PAK3 TIN PLATED SMD		-	Active	Copper	Top Mount	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	D³Pak	SMD Pad	0.401" (10.20mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	14.00°C/W	Tin
	573400D00010G	RFQ VIEW	PDF RFQ	3,147 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK D-PAK3 TIN PLATED SMD		-	Active	Copper	Top Mount	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	D³Pak	SMD Pad	0.401" (10.20mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	14.00°C/W	Tin
	573400D00010G	RFQ VIEW	PDF RFQ	1,326 In-stock	Aavid, Thermal Division of Boyd Corporation	HEATSINK D-PAK3 TIN PLATED SMD		-	Active	Copper	Top Mount	Rectangular, Fins	0.500" (12.70mm)	1.220" (30.99mm)	D³Pak	SMD Pad	0.401" (10.20mm)	1.0W @ 20°C	4.00°C/W @ 600 LFM	14.00°C/W	Tin

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